1) thermal mismatching
热不匹配
1.
Residual stress exists in the PMMA microfludic chip due to the different thermal expansion coefficience,also called thermal mismatching of the mold and the polymer,which can result in the warpage and deformation of the chip.
PMMA微流控基片在热压成形结束后由于模具和聚合物的热膨胀系数不同——热不匹配会产生残余应力,从而造成基片翘曲变形。
2) Thermal-distributing
热量匹配
3) thermal matching
热匹配性
4) Water and heat matching
水热匹配
5) Thermo-match
热匹配
1.
Pattern Recognition Analysis of Lattice-match and Thermo-match for Sample Collection Containing ZnO Semiconductor Material;
含ZnO样本集晶格匹配和热匹配的模式识别分析
6) heat flow match
热流匹配
补充资料：负温度系数热敏电阻陶瓷(见热敏陶瓷)
负温度系数热敏电阻陶瓷(见热敏陶瓷)
thermo-sensitive ceramics with negative temperature coefficient
负温度系数热敏电阻陶瓷thermo一sensitiveeeramies with negative temperature eoeffieient在某一特定温度范围，电阻率随温度的升高而明显减小的热敏陶瓷。简称NTC陶瓷。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条