说明:双击或选中下面任意单词,将显示该词的音标、读音、翻译等;选中中文或多个词,将显示翻译。
您的位置:首页 -> 词典 -> SiCp/AZ81镁基复合材料
1)  SiCp/AZ81 metal matrix composites
SiCp/AZ81镁基复合材料
1.
Influences of different heat treatment methods on the microstructure, compression properties and wear resistance of SiCp/AZ81 metal matrix composites were investigated.
研究了不同热处理工艺对SiCp/AZ81镁基复合材料组织、压缩性能及耐磨性的影响。
2)  SiC/AZ81 Magnesium Matrix Composite
SiC/AZ81镁基复合材料
3)  SiCp/AZ61 magnesium matrix composite
SiCp/AZ61镁基复合材料
1.
The ageing treatment of SiCp/AZ61 magnesium matrix composite fabricated by ultrasonic stirring was studied.
对超声法制备的SiCp/AZ61镁基复合材料进行时效研究,结果表明:在时效过程中析出的第二相经XRD分析为Mg17Al12,且第二相的脱溶方式为连续脱溶与不连续脱溶两种方式同时存在,与基体相比,SiCp/AZ61镁基复合材料在时效时的孕育期要长,且在过时效期显微硬度下降要慢。
4)  SiCp/Al MMCs
SiCp/Al基复合材料
1.
In order to analyze the weldability of SiC particle reinforced aluminum metal matrix composites(SiCp/Al MMCs),plasma arc in-situ welding of SiCp/Al MMCs was carried out using argon-nitrogen mixture as plasma gas with Ti-Mg mixed powder as in-situ material.
为分析SiCp/Al基复合材料的焊接性,以Ti-Mg混合粉末作为填充材料,采用氮氩混合等离子气体对SiCp/Al基复合材料进行等离子弧原位焊接。
2.
Plasma arc "in-situ" welding of SiCp/Al MMCs were carried out using argon-nitrogen mixture as plasma gases with Ti-Ni alloying as "in-situ" material.
以Ti-Ni合金作为填加材料,采用氮氩混合等离子气对SiCp/Al基复合材料进行等离子弧原位焊接。
3.
In this paper,SiCp/Al MMCs were selected as research objects,and process and mechanism of SiCp/6061Al MMCs by plasma arc welding(Ar and N2 as ionized gas, Ar as fielded gas) were systematically studied.
研究表明填加Al-Si-Ti-Ni合金对SiCp/Al基复合材料进行等离子弧原位焊接,填加材料中Ti含量为5%时,可以有效抑制有害相Al_4C_3的生成,得到的焊缝组织较为致密,没有气孔、微观裂纹等缺陷,接头强度较之不加填充材料时有较大提高,达到226MPa,提高了接头的力学性能。
5)  SiCp/Al composites
SiCp/Al基复合材料
1.
The paper is about craft experiment on SiCp/Al composites by the powder-EDM.
利用混粉电火花加工方法对SiCp/Al基复合材料进行了工艺实验。
6)  SiC_p/Cu matrix composites
SiCp/Cu基复合材料
1.
The influence of submicron SiC_p content on electrical conductivity, Vickers hardness, ultimate tensile strength, elongation to failure and sliding wear-resistance, of submicron SiC_p/Cu matrix composites, were investigated.
以亚微米级(130nm)碳化硅颗粒(SiCp)和微米级(10μm)Cu粉为原料,采用冷压烧结和热挤压方法制备出SiCp/Cu基复合材料,研究其SiCp含量对SiCp/Cu基复合材料电学、力学和摩擦学性能的影响。
补充资料:碳化硅颗粒增强镁基复合材料
分子式:
CAS号:

性质:以镁合金为基体,由碳化硅颗粒增强的金属复合材料。通常加入3~20μm的颗粒15%~25%可明显提高材料的强度(拉伸强度399~428MPa)、弹性模量(79~84GPa)和延伸率(5.7%)。采用粉末冶金法和搅拌熔铸法制造,因具高比强度、比模量和耐磨性。用于制造齿轮、泵盖和武器零件。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条