说明:双击或选中下面任意单词,将显示该词的音标、读音、翻译等;选中中文或多个词,将显示翻译。
您的位置:首页 -> 词典 -> 微凹坑
1)  micro-pit
微凹坑
1.
The micro-pits of working surface between friction pairs with regular profiles can modify surface tribology character,improve lubrication and wear-resisting.
在摩擦副表面加工一定规则形貌的微凹坑可改善表面摩擦特性,提高润滑、耐磨性能。
2.
The array micro-pits with regular profiles can modify surface tribology character, improve lubrication and wear-resisting.
具有一定规则截面形状的阵列微凹坑结构,可以有效改善润滑和抗磨效果,目前成熟的微凹坑加工方法极少。
2)  Micro-pits
微凹坑
1.
Design and Test of Special Machining for Micro-pits of Working Surface Between Friction Pairs
摩擦副表面圆形微凹坑特种加工工艺设计与试验
2.
Micro-pits are machined on stainless steel and sintered carbide by ultrasonic combined electric micro-machining technology.
摩擦副表面规则形貌的微凹坑可以改善表面摩擦学特性,提高润滑耐磨性能。
3)  simple [英]['sɪmpl]  [美]['sɪmpḷ]
凹坑,表面微凹
4)  dimple [英]['dɪmpəl]  [美]['dɪmpəl]
凹坑
1.
Review of heat transfer enhancement for dimpled surface;
凹坑强化传热的研究进展回顾
2.
Influence of dimple space on heat transfer enhancement and pressure loss in a dimpled rectangular channel
间距对凹坑强化传热和流动阻力的影响
3.
The application shows that the optimization can greatly reduce the dimple magnitude and improve the punching quality.
实践证明:优化后的凸模在很大程度上减小了凹坑的塌陷量,提高了产品质量。
5)  pit [英][pɪt]  [美][pɪt]
凹坑
1.
Limit load analysis on spherical head with pit located in the structural discontinuity area;
球形封头上结构不连续处凹坑极限载荷分析
2.
Cause Analysis and Prevention of Pit Defect on Drum after Plate Winding;
钢板卷筒后筒体表面凹坑缺陷的成因分析与预防
3.
Safety Assessment for Featheredged Sleeve Press-Ure Vessel Containing Pit Defects and Research for Fatigue Life of Numerical Simulation;
含凹坑缺陷薄壁圆筒形压力容器的安全评定以及疲劳寿命的数值模拟研究
6)  part-through slot
凹坑
1.
40 of "pressure vessels periodical inspection regulation",the stress distribution of local thinned area in the boundary stress region of nozzle-cylinder is calculated and the trends of stresses influenced by the dimension and location of part-through slot are obtained.
参考《压力容器定期检验规则》第40条,采用有限元方法计算了筒体接管边缘应力区局部减薄处的应力分布,得到了局部减薄处凹坑的尺寸与位置对应力的影响趋势,讨论了应力集中系数随尺寸变化的规律,为筒体接管边缘应力区局部减薄处的强度评定提供了一定的计算依据。
补充资料:凹坑
分子式:
CAS号:

性质:半导体在像工艺中的一种局部区域缺陷,其特征是图像从边界向内部延伸的缺损。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条