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1)  circulating temperature
循环温度
1.
Drilling fluid circulating temperature plays a very important role in predicting the equivalent circulating density of drilling fluids and in determining safe density windows.
钻井液循环温度是预测钻井液循环当量密度、确定钻井安全密度窗口的重要影响因素之一。
2.
Bottom-hole circulating temperature not only directly impacting rheological properties,density and chemical stability of drilling fluid,etc.
井下循环温度不但直接影响钻井液的流变性、密度及化学稳定性等,而且与井内压力平衡、循环压耗、套管和钻柱强度设计等有关,因此准确确定钻井作业时井内循环温度的分布和变化规律对钻井循环压耗、井控和安全快速钻进具有极其重要的意义。
3.
It is important for the drilling and completion to learn about accurate distribution of circulating temperature in the wellbore.
准确的井下循环温度对钻井与完井工程十分重要。
2)  thermal cycle
温度循环
1.
This paper introduces techniques problems in the ultrasonic bonding of thick film spun gold and gold conductor,and tests the bonding performance of spun gold and gold conductor with the methods of the ruinous pull test and the thermal cycle test after indoor and environment tests.
介绍了厚膜金丝与金导体超声键合遇到的工艺问题,并用破坏性拉力和温度循环试验方法,分别在室温和其它环境下试验后,测试金丝与金导体超声键合的性能。
2.
In order to accomplish the environment stress screen of space borne infrared detectors and study the failure mechanism dur-ing the course of thermal cycle,the thermal cycle system,based on singlechip is introduced in this paper.
由于航天工程的需要,为了对航天用红外探测器进行环境应力筛选并研究器件在高低温循环过程中的失效机理,本文提出了一种基于单片机控制的温度循环试验自动控制系统。
3.
Thus such cryogenic semiconductor components as HgCdTe mid or long wavelength infrared(IR) detectors are subjected to thousands of repeated thermal cycles from below-173℃ to room temperature.
在某些情况下斯特林制冷机采用间歇式工作方式,以延长卫星在太空中的服务年限,因此由斯特林机致冷的低温半导体器件如HgCdTe中长波红外探测器会经受成千上万次从-173℃以下到常温的温度循环,这个过程可能会造成器件的失效。
3)  temperature cycle
温度循环
1.
A control circuit for presetting,displaying,counting welding temperature cycles and automatically switching;
焊接温度循环次数预置、显示、计数及自动通断电控制电路
2.
Distribution of equivalent stress and plastic strain for solder joints array under temperature cycle was studied and located the maximum stress and strain solder joints respectively;The dynamic curve of equivalent stress and plastic strai.
以Aand统一粘塑性本构方程描述无铅焊点的粘塑性行为,研究了在温度循环载荷下焊点阵列等效应力和塑性应变的分布规律,找出了实体模型中最大应力和应变的焊点位置;分析了最大应变焊点的等效应力周期性变化和等效塑性应变累积的动特性曲线;基于Manson-Coffin焊点疲劳寿命模型,对关键焊点进行了寿命预测,疲劳寿命值为3。
3.
The stability of CdS/CdTe solar cells is investigated at the temperature cycles.
 对CdS/CdTe太阳电池在温度循环下的稳定性进行了研究,测定了其I V特性曲线,并与室温下的电池作了比较。
4)  temperature cycles
温度循环
1.
This article analyses the changing of some performance parameters of modern building curtain walls of some plaza in Chongqing city, by proceeding the tests of air permeability performance, water-tightness performance, wind resistance performance, performance in plane deformation, and high-low temperature cycles.
本文结合重庆某广场建筑幕墙的气密性能、水密性能、抗风压性能、平面内变形性能以及高低温循环性能等试验结果,分析了现代建筑幕墙的几种性能参数的变化,在本领域的检测中,首次提出并实践了温度循环的检测方法。
5)  temperature cycling
温度循环
1.
In this paper, our recent results on temperature cycling experiment in the systems consisting electron donor, acceptor and polymer host were reported.
本文对电子给体、受体双掺杂在高分子薄膜中形成的光谱烧孔体系,做温度循环实验,研究体系中电子-声子的相互作用,得到了表征电子-声子耦合强度的黄昆因子和薄膜中局域振动的声子频率。
2.
According to the results of internal temperature change measurement during temperature cycling for the electronic device of missile, the influence of the temperature alteration ratio on screening degree and cycling times is discussed, and the functions of increasing temperature alteration ratio in the process of temperature cycling are expounded.
根据弹用电子设备在温度循环时内部温度变化的测定结果,论述了温度变化率对筛选度和循环次数的影响,从而阐明了在温度循环过程中提高温度变化率的作用。
6)  thermal cycling
温度循环
1.
The thermal fatigue failure of SnPb solder joints of flip chip on board with and without underfill is investigated for two types of flip chip packages by conducting thermal cycling tests,C SAM observations and cross section inspections.
测量了有无芯下填料 B型和 D型两种倒扣芯片连接器件的焊点温度循环寿命 ,运用超声显微镜 (C- SAM)和扫描电镜 (SEM)观察了焊点微结构粗化和裂纹扩展 ,并采用三维有限元模拟方法分析了焊点在温度循环条件下的应力应变行为 。
补充资料:铂电阻温度表(见电阻温度表)


铂电阻温度表(见电阻温度表)


表。bod旧nZu wendubiao铂电阻温度表见电阻温
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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