1) Profoundity
深微化
2) deeper and thinner hole
深微孔
1.
The physical simulation of combined extrusion about the products with deeper and thinner hole;
深微孔复合挤压成形工艺的物理模拟
2.
This paper studies the forming of deeper and thinner hole in the way of combined extrusion.
利用两种材料 (一种为填料 )复合在一起进行挤压 ,挤压完成后将填料除去的工艺方法成形深微孔 ,室温物理模拟对挤压比、填料直径等工艺参数进行了探讨 ,并得出合理的工艺参数。
3) micro-mesa arrays
深微台面列阵
1.
Some research results of the profile of HgCdTe micro-mesa arrays isolated by dry-etch process are presented.
文章报道了碲镉汞(HgCdTe)深微台面列阵干法隔离的轮廓研究的初步结果。
补充资料：深微
1.深奥微妙。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。