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1)  antiseptic selection
防腐剂选择
2)  selective etchant
选择腐蚀剂
3)  selective corrosion
选择腐蚀
4)  septic (antiseptic)
腐败(防腐剂)
5)  selective corrosion
选择性腐蚀
1.
The Si-TaSi2 field emitter arrays were fabricated according to the selective corrosion theory.
依据选择性腐蚀的原理,把电子束区熔技术制备的Si-TaSi2共晶自生复合材料制作为Si-TaSi2场发射阴极阵列。
2.
The cleaning was satisfactory and no selective corrosion and pit corrosion occurred to aluminum brass.
清洗效果理想,没有发生铝黄铜选择性腐蚀及点蚀,除垢率达到98%以上,达到了预期的目的。
6)  selective etching
选择性腐蚀
1.
The selective etching of GaAs/Al XGa 1-x As(x=0 8~0 9)heterostructure,of which the GaAs solar cell of conventional structure is made,is a key process in the fabrication of solar cell removing the GaAs cap layer everywhere except under the grid lines and exposing the AlGaAs window layer.
对该异质结构的只腐蚀GaAs而不腐蚀AlGaAs的选择性腐蚀工艺是GaAs太阳电池制备过程中的一道关键工序。
2.
In order to solve the problem of selective etching of the sacrificial layer in the MEMS fabrication technique,a new way to judge whether the sacrificial layer is etched completely was pointed out.
针对MEMS(micro-electro-mechanical system)工艺中牺牲层的选择性腐蚀问题,提出了一种判断牺牲层是否完全腐蚀的新方法,解决了这一工艺难点。
3.
A optimized process consisting of two-step selective etching is proposed to solve the problem that the selectivity between TiN/Ti and TiSi_2 is poor with the conventional RCA1(NH_4OH:H_2O_2:H_2O) solution and results in a loss of a substantial part of the formed silicide thickness and hence in an increase of the contact resistance.
针对传统TiSi_2工艺中RCA1(NH_4OH:H_2O_2:H_2O)溶液对于TiN/Ti与TiSi_2的选择性不好会造成硅化物的损失、提高接触电阻的问题,提出一种采用2次选择性腐蚀的工艺方法进行改善。
补充资料:DMDM防腐剂
CAS:6440-58-0
分子式:C7H12N2O4
分子质量:188.1828

中文名称:1,3-二(羟甲基)-5,5-二甲基咪唑烷-2,4-二酮
DMDM防腐剂
1,3-二羟甲基-5,5-二甲基海因

英文名称:4-Imidazolidinedione, 1,3-bis(hydroxymethyl)-5,5-dimethyl-2
1,3-di(Hydroxymethyl)-5,5-dimethylhydantoin
1,3-bis(hydroxymethyl)-5,5-dimethylhydantoin
1,3-dimethylol-5,5-dimethylhydantoin
1,3-bis(hydroxymethyl)-5,5-dimethyl-4-imidazolidinedione

用途:洗发香波、护发素、化妆品杀菌防腐剂。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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