1) distribution of particle sizes
晶粒大小分布
2) phase analyzed laser-light scattering
粒度大小及分布
4) size and distribution
粒径大小与分布
1.
The influence factors of the types of organic solvents, emulsifier type, stability agent and shearing rate on the size and distribution of microcapsules were studied.
研究了有机溶剂种类、乳化剂种类以及剪切分散速率等因素对微胶囊粒径大小与分布的影响,并分别用光学显微镜和扫描电镜观察分析了微胶囊的形貌。
5) crystallite size
晶粒大小
1.
In this study,the least square method for separating twofold broadening effect of crystallite-fault were proposed and used to characterize the average crystallite size and stacki.
为了表征这种纳米ZnO的晶粒大小和层错几率,提出了分解纳米ZnO微晶-层错二重宽化效应的最小二乘法。
2.
The result shows that its crystallite size is decreased,micro\|strain and effective temperature are increased as well as its crystalline lattice is disordered with grinding time increasing.
研究表明 :随着粉磨的进行 ,金红石型TiO2 的晶粒大小D减少、显微应变ε增加 ,有效温度系数增加 ,晶格无序化程度增强。
3.
And the calculation of crystallite size derived from Debye-Scherrer s equation is carried out in terms of Least Square Method by self-written VB program.
然后在Debye-Scherrer方程的基础上运用最小二乘法对晶粒大小进行计算,这一过程由自编的VB程序完成。
6) Grain size
晶粒大小
1.
The effects of extrusion deformation on grain size and properties of AZ31 magnesium alloy;
热挤压工艺对AZ31镁合金晶粒大小及性能的影响
2.
The lattice parameter and the grain size of BaTiO3 nanocrystal were calculated.
用X射线粉末衍射仪对粉体的晶态进行了表征,计算了BaTiO3粉体的晶格常数,以及不同焙烧温度下BaTiO3粉体的晶粒大小。
3.
The results indicate that the processing times has no prominent effect on the grain size of friction stir processed zone.
结果表明:加工次数对搅拌摩擦区晶粒大小影响不大;但加工次数多可增加搅拌摩擦区组织的面积,并使组织均匀化;使热机械影响区组织向搅拌摩擦区组织发生转变;增大轴肩下压区细晶组织面积,进一步细化轴肩下压区的晶粒。
补充资料：Assembly晶粒封装
以树酯或陶瓷材料，将晶粒包在其中，以达到保护晶粒，隔绝环境污染的目的，而此一连串的加工过程，即称为晶粒封装（assembly）。封装的材料不同，其封装的作法亦不同，本公司几乎都是以树酯材料作晶粒的封装，制程包括：芯片切割→晶粒目检→晶粒上「架」（导线架，即lead frame）→焊线→模压封装→稳定烘烤（使树酯物性稳定）→切框、弯脚成型→脚沾锡→盖印→完成。以树酯为材料之ic，通常用于消费性产品，如计算机、计算器，而以陶瓷作封装材料之ic，属于高性赖度之组件，通常用于飞弹、火箭等较精密的产品上。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条