1) microfabrication
微刻
2) micro-scratch
微刻划
3) trench
微刻槽
1.
The procedure and mechanism of copper filling in the trench of the chip are reviewed, the effect of electrolyte components and additives on superfilling are discussed.
综述了铜在芯片微刻槽中电沉积填充的过程、机理 ,并着重讨论了实现无裂缝和无空洞理想填充的主要因素—镀液的组成和添加剂的影响。
4) Micro-etching
微刻蚀
5) Microsculpturing
微刻点
6) laser micromachining
激光微刻蚀
1.
A polyimide suspended microbridge was manufactured with laser micromachining by Pt heat-sensitive thin film prepared by pulsed laser deposition technology.
由于没有现成的将聚酰亚胺制成微桥的工艺,采用准分子激光微刻蚀技术,使用聚酰亚胺材料,并采用铂作为敏感材料来制作微桥。
参考词条
补充资料：刻划
1.雕刻;刻印。 2.用文字等描摹表现。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。