1) vertical connection with body
垂直连体
2) vertical interconnection
垂直互连
1.
3D stacked modular package of MEMS accelerometer and alignment of vertical interconnection;
MEMS加速度计三维堆叠模块化封装及垂直互连
2.
Vertical interconnections are typical structures in three dimensional microwave and millimeter wave integrated circuits.
垂直互连是三维微波和毫米波集成电路中的典型结构。
3.
Under the present experimental conditions, the practical study on technology of vertical interconnection micro-assembly has been done in this article.
结合目前的实验条件,本文对垂直互连微组装工艺进行了实际实验研究,主要包括相应的结构设计及样片制作、验证了相关的加工工艺及组装系统的垂直互连连通性。
3) vertical interconnect
垂直互连
1.
From the point of vertical interconnect via, the matrix pencil moment method, FDTD, edge-element FEM, microwave network model method and CAD model method of vertical via interconnect were introduced.
从垂直互连通孔入手,介绍了垂直通孔互连的矩阵束矩量法、时域有限差分法、边基有限元法以及微波网络模型法和CAD模型法,分析了这些方法已经取得的结果,并指出了这些方法的优缺点。
2.
This paper deals mainly with the recent development of 3-D MCM packing technology in VLSI with emphasis on 3-D MCM packing vertical interconnect technology.
介绍了超大规模集成电路(VLSI)用的3-DMCM封装技术的最新发展,重点介绍了3-DMCM封装垂直互连工艺,分析了3-DMCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题,并对3-DMCM封装的应用作了简要说明。
5) vertical links
垂直连杆
6) vertical feedthrough
垂直互连线
1.
In this paper, a novel packaging structure model which is performed using wafer level micropackaging on the thin silicon substrate as the Ka band distributed MEMS phase shifters wafer with vertical feedthrough is presented.
本文提出一种适用于Ka波段分布式MEMS移相器的新型封装结构——具有垂直互连线的薄硅作为分布式MEMS移相器衬底,并用芯片微封装方法对移相器进行封装。
补充资料：连体
1.形体相连。 2.形容关系极为密切。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条