1) micro-heat sink
微热沉
1.
The design and fabrication of a micro-heat sink that is integrated with microchannels,micro-temperature sensors and micro-heater are introduced in details.
该集成微热沉系统可用于微电子芯片的发热模拟以及微热沉冷却性能的实验研究。
2) microchannel heatsinks
微沟热沉
3) microchannel heat sink
微通道热沉
1.
Process and test of V-shaped microchannel heat sink;
V型微通道热沉的加工与测试
2.
Silicon microchannel heat sinks for high-power laser diode arrays
大功率激光二极管列阵的硅基微通道热沉研制
3.
Taguchi robust design method was applied to the design of silicon microchannel heat sinks.
将田口稳健设计方法用于硅基微通道热沉的优化设计,建立了微通道热沉的简化性能分析模型,确定了影响其散热性能的关键参数,利用正交试验和信噪比分析实现了参数的稳健优化。
4) microchanne cooled headsinks
微沟道热沉
5) microchannels heat sink
微槽道热沉
1.
Optimization design and numerical simulation of microchannels heat sink are then studied.
分析了高热流密度芯片的冷却要求,对微槽道热沉的优化设计和数值模拟进行了研究。
6) microchannel heatsink
微通道热沉
1.
In order to increase the output power, reliability and stabilization, microchannel heatsink which is one of active heatsinks is used to cool high power semiconductor diode laser arrays in the paper.
为了提高激光器的输出功率、可靠性和稳定性，本论文选取无氧铜微通道热沉来冷却大功率半导体激光器列阵，以实现较低的热阻和良好的温度均匀性。
2.
Structural parameters of microchannel heatsink such as thickness of the front wall and width of the turn-over channel are optimized through numerical calculation based on general industrial processing.
根据大功率半导体器无氧铜微通道热沉的实用化制备工艺特点,利用商用CFD软件FLUENT对微通道热沉内部微通道散热区层间折转通道宽度和热沉前端面壁厚度进行优化设计,并采用化学腐蚀结合扩散焊技术制备无氧铜微通道热沉,微通道尺寸为27 mm×11 mm×1。
3.
Separate heat source profile basing on structure of semiconductor laser array is applied in thermal resistance calculation of microchannel heatsink as boundary condition.
针对现有高光束质量大功率半导体激光阵列内部发光单元条宽、填充因子不断减小,腔长不断增加的发展趋势所带来的热源分布及长度变化影响器件热阻的问题,利用分离热源边界条件结合商用计算流体力学(CFD)软件FLUENT进行数值计算,获得微通道热沉热阻随阵列器件发光单元条宽、空间位置变化关系以及不同阵列腔长对应的微通道优化长度。
补充资料：微热
微热
又称"低热"。身体自觉发热，热势不高，体温不超过38℃的表现。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条