1) Pb-Sn-Te alloy
铅锡碲合金
2) lead tellurium alloy
铅碲合金
3) tin-lead alloy
锡铅合金
1.
Studies on the effect of plating parameters on tin-lead alloy electroplating in alkylsulfonate baths;
烷基磺酸盐电镀锡铅合金工艺影响因素的研究
2.
Determination of tin and lead content in fluoborate tin-lead alloy plating baths;
氟硼酸盐锡铅合金镀液中锡、铅含量的测定
3.
Effects of technological parameters on methane-sulfonate tin-lead alloy electroplating;
工艺参数对甲基磺酸盐镀锡铅合金的影响
4) Pb-Sn alloy
铅-锡合金
1.
The aluminum for light-grid material in lead-acid batteries was electroplated with Pb-Sn alloy from sulphamate bath,and the opitimum technology condition and electrolyte composition were determined.
利用氨基磺酸盐镀液在铝合金基体上电镀铅-锡合金作为铅酸蓄电池的轻型板栅材料,确定了最佳电镀工艺条件和镀液配方。
5) Pb-Sn alloy
铅锡合金
1.
Effects of tin content on the oxygen evolution behavior of Pb-Sn alloys;
锡含量对铅锡合金析氧行为的影响
2.
A two-layered structure of eutectic-solid sulotion is formed in the microstructure of Pb-Sn alloy obtained from quasi-two-dimensional electrodeposition.
铅锡合金的准二维电沉积物具有伪共晶-固溶体双层结构。
3.
This article,using the diffusion theory in solid metals,discusses in detail the mechanism of hot-dip Pb-Sn alloy coating of the double-wall brazed tube,and analyzes the existing defects in the production of pb-Sn hot-dip coated double-wall brazed tube in line with the theory on Pb-Sn alloy corrosion resistance.
应用固态金属中的扩散理论详细论述了在双层卷焊钢管上热镀铅锡的机理；应用铅锡合金耐蚀性理论对热镀铅锡双层卷焊钢管生产中所存在的缺陷进行了分析。
6) Sn Pb alloy
锡铅合金
1.
The wastewater treatment of Sn Pb alloy electroplating and polishing passivation of brass were harsh, owing to the complex composition, diversity of harmful substances, and fluctuant concentrations of the ingredients to be removed.
黄铜带电镀锡铅合金及黄铜抛光钝化的废水成分复杂、有害物质浓度高且波动性强,分流调匀后采用物化和生化相结合的工艺处理,同时应用了pH/ORP控制与计算机控制相结合的自动化控制系统,实际运行效果良好,出水能达标排放。
2.
The electroless Sn Pb alloy plating process in methylsulfonic acid system was studied.
研究了甲基磺酸体系化学镀锡铅合金。
补充资料：碲锡铅
分子式：
CAS号：
性质： Pbl-xSnxTe 0≤x≤1 三元固溶半导体材料。为碲化铅和碲化锡的连续固溶体，氯化钠型结构，为直接带隙半导体。变换x值，可使其带隙由0变到0.22eV，非掺杂晶体如富金属则呈n型，富碲则呈p型，在碲化铅衬底上采用气相外延、分子束外延等方法制取。主要用于制作红外激光器和探测器。
CAS号：
性质： Pbl-xSnxTe 0≤x≤1 三元固溶半导体材料。为碲化铅和碲化锡的连续固溶体，氯化钠型结构，为直接带隙半导体。变换x值，可使其带隙由0变到0.22eV，非掺杂晶体如富金属则呈n型，富碲则呈p型，在碲化铅衬底上采用气相外延、分子束外延等方法制取。主要用于制作红外激光器和探测器。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条