1) Cu-In alloy film
Cu-In合金膜
1.
The Cu-In alloy films were prepared on Mo substrate by ultrasonic electrodepositing and heat treatment (two-step method) and ultrasonic co-electrodepositing (one-step method).
分别用SEM,EDS和XRD分析了Cu/In双层膜以及Cu-In合金膜的表面形貌、成分及相组成。
2) Cu-Zr alloy films
Cu-Zr合金膜
1.
Cu -Zr alloy films were deposited on TiN,TaN and ZrN diffusion barriers with co -sputtering technology that combined magnetron sputtering(MS )and ion beam sputtering(IBS).
用磁控溅射和离子束溅射共沉积的方法,分别以TiN、TaN、ZrN为扩散阻挡层,在单晶硅片上制备了Cu-Zr合金膜,膜在400oC氮气中退火1h。
3) Cu-Cr alloy films
Cu-Cr合金膜
1.
Cu-Cr alloy films were deposited on different diffusion barrier layers with ion beam auxiliary co-sputtering that combined magnetron sputtering(MS) and ion beam sputtering(IBS) .
用离子束辅助磁控溅射和离子束溅射共沉积的方法分别在TiN、CrN扩散阻挡层上沉积了Cu-Cr合金膜。
4) Pd-Cu alloy composite
Pd-Cu合金复合膜
5) Cu(Zr)Alloy Films
Cu(Zr)合金薄膜
6) Co-Cu alloys films
Co-Cu合金薄膜
补充资料:A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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