1) two step depositing Ti/Al/Ti/Au
两步镀膜Ti/Al/Ti/Au
2) Ti/Al coatings
Ti/Al镀层
1.
Al, Ti/Al coatings on U substrates were prepared by repeated Ar+ bombardment-magnetron sputter ion plated (MSIP).
用循环Ar+轰击-磁控溅射离子镀(MSIP)法在U表面上镀Al,Ti/Al,并采用俄歇电子能谱仪(AES)、扫描电镜(SEM)、电化学实验和平面磨耗实验,研究了其表面、剖面形貌和耐磨耐蚀性能,以及Al/ U和Ti/Al镀层界面。
3) (Ti,A1)N film
(Ti,Al)N膜
4) (Ti,Al)N films
(Ti,Al)N镀层
5) Multi-arc plated Ti-N film
Ti-N镀膜
补充资料：TC4(Ti6Al4V)焊接组织
TC4(Ti6Al4V)焊接组织
719
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条