1) Pb/Sn bump
Pb/Sn凸点
1.
Because of excellent property and low cost, Pb/Sn bump plays a key role in chip level packaging.
在实际使用条件下,Pb/Sn凸点会由于承受温度循环而产生剪切应力,剪切应力导致的主要失效方式是开裂。
2) Sn-Pb solder joint
Sn-Pb焊点
4) Pb-Sn Alloy
Pb-Sn合金
1.
Solidification Structure of Pb-Sn Alloy in Rotating Magnetic Field;
旋转磁场作用下Pb-Sn合金的凝固组织
2.
Modeling of Non-isothermal Dendrite Growth in Pb-Sn Alloy;
非等温Pb-Sn合金枝晶生长的数值模拟
5) Sn-Pb alloy
Sn-Pb合金
1.
Bright Sn-Pb alloy electroplating technology with citric acid and EDTA as the complexing agent, and QB-1 as the additive was studied.
研究了以柠檬酸和EDTA为络合剂,QB-1为添加剂的电镀光亮Sn-Pb合金工艺。
2.
Concentrates of Hydroxyalkylsulfonates of Sn and Pb for Sn-Pb alloy electroplating developed and produced in China have been used by some factories in productin.
我国自行研制生产的羟基烷基磺酸电镀Sn-Pb合金镀液已经在部分厂家投产使用。
3.
Therefore, the Sn-Pb alloy loaded polymer composites have many special properties for their low melting point, which are not held by usual materials.
与通常的金属相比，Sn-Pb(Tm=183℃)合金具有较低的熔点，在通常的聚合物的加工温度窗口能够实现固态与液态之间的转变，因此如果选用Sn-Pb合金作为填料，制得的聚合物基复合材料能够在制备和使用的过程中实现刚性粒子和可变形液滴之间的转变，填料物态的转变会给复合材料带来一些特殊的性能。
6) Sn-Pb solder
Sn-Pb钎料
1.
The traditional Sn-Pb solder alloys and other solder alloys based on Pb have lowly mechanical properties except for their poison.
传统的Sn-Pb钎料及Pb基软钎料除有毒外,还存在力学性能方面的问题。
补充资料：凸凸
1.高出貌。
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参考词条