1)  chip-on-board
chip-on-board
1.
Later,the heat performance of LED package utilizing chip-on-board technology on a novel composite materials with high thermoconductivity was studied.
最后分析了LED芯片采用chip-on-board技术封装在新型高热导率复合材料散热板上的散热性能。
2)  CH +
CH~+
3)  CH
CH
1.
An Interactive Open Architecture Computer Vision Platform: Ch OpenCV;
交互式开放结构计算机视觉平台Ch OpenCV
2.
Structure and potential energy function of ground-state CH and CH_2 free radical;
自由基CH和CH_2的基态结构与势能函数
3.
Distinguish zh, ch, sh from z, c, s Respectively with the Rule of Pronunciation Variation between Ancient and Modern Times;
利用古今音变规律分辨zh、ch、sh和z、c、s
4)  CH(A)
CH（A）
5)  CH/π
CH/π
1.
Synthesis and Studies on CH/π Interaction in Crystal Srtucture of Half Flexible Clip Molecules Based on Diethoxycarbonyl Glycoluril;
基于二乙酯基甘脲半柔性分子夹的合成及晶体中CH/π的研究
2.
At first,molecules stack through π/π or/and CH/π interactions, and then H-bonds connect the molecule stacks along the molecule planes, resulting in 3D ordered crystals.
结果表明:在4,7-取代的香豆素晶体的自组装过程中,分子一般首先通过芳环之间的π/π作用或π/π和CH/π共同作用形成分子堆,分子堆之间再沿侧向(分子所在平面)通过氢键,形成网络堆积成三维晶体。
3.
As shown by the results, in the crystal structures where the strong formation groups of hydrogen-bonds lack, weak interactions such as CH/π, π/π and weak hydrogen-bond (C—H…X, X——O, N, Cl, Br) play important roles in the molecular self-assembling into crystal structures and affect the crystal symmetry.
结果表明:在这些缺少强氢键生成基团的晶体结构中,弱相互作用π/π,CH/π及弱氢键(C—H…X,X——O,N,Cl,Br)对分子自组装成晶体的过程及对晶体的对称性产生重要影响。
6)  CH
CH型
1.
CH ash scavenger was adopted in the atmospheric furnace on line ash clearing and good effect has been .
根据CH型清灰剂的化学清灰原理将其应用于常压炉的在线清灰 ,取得了很好的效果 ,炉膛温度降低了 10 5℃ ,降低了能耗 ,恢复了装置的正常生
参考词条
补充资料：building paper and board
分子式：
CAS号：

性质： 在建筑业中使用的各种纸和纸板的统称。建筑用纸包括壁纸、石膏板纸、石棉纸、软木纸、油毡纸、纸蜂窝板、铝箔波形纸等。建筑用纸板主要有硬质纤维板、隔音纸板、石膏纸板、塑料贴面纸板等。用在建筑工程中，起到装饰和保温、隔热、防震、吸声等作用。除具有较高的强韧性外，还根据不同的用途而具有一些特殊的性质。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。