1) global planarization
全局平面化
1.
Now, CMP has been regarded as the unique technology to meet the need of global planarization.
随着集成电路工业的发展，芯片集成度不断提高，特征尺寸不断减小，为了改善芯片电学性质，需要采用多层金属布线结构，导致芯片表面要求达到全局平面化，而传统的抛光工艺已不能满足这一要求，现在CMP工艺已被人们认为是唯一可实现全局平面化的工艺。
2) CMP
化学机械全局平面化
1.
The principle and techniques about CMP for tungsten plug in ULSI were studied.
对目前超大规模集成电路钨插塞化学机械全局平面化(CMP)的原理及工艺进行了分析,对钨抛光浆料的组成成分进行了研究,开发了一种能够适合工业生产的钨的碱性抛光浆料,并对钨抛光浆料今后的发展进行了展望。
3) Global planarization
全局平坦化
1.
After four kinds of planar methods are compared,as unique global planarization method,the development,application and prospects of chemical mechanical polishing are .
在比较了IC工艺中的四种平坦化技术基础上,重点综述了唯一可以实现全局平坦化的化学机械抛光(CMP)方法的发展、应用及展望。
4) Global functional plane
全局功能平面
5) global sea-level change
全球海平面变化
1.
The following factors controlled the Sr-isotope composition and evolvement in sea water since 100Ma: the possible impact of extraterrestrial object;the global sea-level change and the spread rat.
100 Ma以来海水锶同位素的变化主要可能与星外物体对地球的撞击作用;全球海平面变化及洋中脊扩张速度的改变;喜马拉雅—青藏高原的隆升;玄武岩喷发和冰川作用因素有关。
6) plane layout
平面布局
1.
From gradual growth,"greater integration" growth,ideas,active city space,plane layout of architecture and other aspects growth law of city is studied in order to create pleasurable man-made and natural environment to improve the quality of space environment.
阐述了城市生长最高原则的定义及目的,从逐步生长、"更大整合"的生长、构想、积极的城市空间和建筑的平面布局等探索出城市具体生长的法则,从而造就使人类活动更有意义的人为环境和自然环境,改善人的空间环境质量。
2.
Combined with practice in fire safety design of civil buildings,from plane layout,arrangement principle,smoke bay,safety evacuation,material selection for decoration and other aspects fire protection technology of building is discussed in order to improve fire safety design quality of building to reduce fire hazard.
结合民用建筑防火设计实践,从建筑的平面布局和布置方法、防火防烟的分区、安全疏散问题、装修材料的选择等方面论述了建筑防火技术,从而提高建筑物的防火设计水平,减少火灾的发生。
补充资料：公理化方法(见公理化和形式化)
公理化方法(见公理化和形式化)
axiomatical method
gongllbuafangfa公理化方法化和形式化。(axiomatieal method)见公理
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条