1) Drill dirt cleaning
去除钻污
2) desmear
去钻污
1.
At the same, desmear, CAF and IST were introduced according to literature after 2006.
同时,对无铅兼容覆铜板去钻污特点、导电阳极丝(CAF)与互连应力测试(IST)等研究热点进行了评述。
2.
The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.
该孔金属化工艺是整个刚挠结合板生产制造工艺的核心,包括钻孔、去钻污、化学镀铜、电镀铜等工序。
3.
The hole metallization which including Drill, Desmear, Nonelectrical plating,Electrical plating etc.
孔金属化工艺是一个贯穿整个FPCB(挠性印制线路板)生产的关键工艺,包括钻孔、去钻污、化学镀铜、电镀铜等工艺,由于工序长,步骤多,若是处理不好,就会造成产品合格率极低,产生很大浪费。
4) greasiness removal
污渍去除
5) oily waste degradation
油污去除
6) dismantling decontamination
拆除去污
1.
For the deepth and content it may divided into system decontamination and dismantling decontamination;there are four decontamination process,the chemical,the physical, the electrochemical and the commination of physial and chemical.
就去污的深度和内函而言,它分系统去污和拆除去污;就去污的机理而言,它可简化为化学去污、物理去污、电化学去污和物理化学联合去污四大类。
补充资料：冻土钻(见取土钻)
冻土钻(见取土钻)
dongtuzuan冻土钻见取土钻
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条