1) Material chip
材料芯片
1.
In the last few years,inkjet technique has attracted great attention for its use as a form-free fabrication method for building 3-D structure of inorganic materials and combinatorial material chips.
近年来,喷墨制备技术被用于无机材料复杂三维结构无模成型和材料芯片的制备中,受到了国内外研究人员的广泛关注。
2) chip materials
芯片材料
3) Chip-level interconnected material
芯片级互连材料
4) combinatorial material chip approach
组合材料芯片技术
1.
The combinatorial material chip approach,which is a method to discover and optimize novel materials,is introduced in this paper,and some examples of the application to the metal materials are given.
介绍了一种快速发现和优化新材料的方法——组合材料芯片技术,并举例说明了其在金属材料研究领域中的应用;同时分析了该方法的先进性和局限性以及应用到金属材料时要解决的主要问题。
5) combinatorial
[英][,kɔmbinə'tɔ:riəl] [美][kəm,baɪnə'tɔrɪəl]
组合材料芯片技术
1.
In present work, combinatorial material chip approach was used to optimize new phosphors Gd1-xAlO3:Eux3+.
将组合材料芯片技术中梯度组合法应用于新型发光材料Gd1-xAlO3:Eux3+(发光峰主峰位置为615nm,对应Eu5D0→7F2电子跃迁)的激活剂掺杂量优化。
2.
The quaternary discrete combinatorial material chip approach was used to optimize new phosphors Gd_(3(1-x))Al_5O_(12)∶RE_(3X).
将组合材料芯片技术中四元组合法应用于新型发光材料Gd3(1-x)Al5O12∶RE3X的RE激活剂和敏化剂种类优选。
3.
Furthermore, high throughput synthesis is the basic of combinatorial materials science and technology.
组合材料芯片技术是近几年发展起来的一种快速发现、优化和筛选新型功能材料的方法。
6) combinatorial material chip technology
组合材料芯片技术
1.
Using the combinatorial material chip technology,Zn-Al-Ti thin films with different Ti contents(where the mass fraction of Al to Zn are 55%and 45%,respectively) were synthesized on the low-carbon substrate by an ion beam sputtering method.
应用组合材料芯片技术,以离子束溅射法在低碳钢基片上制备了不同Ti掺杂量的Zn-Al-Ti薄膜(Al和Zn质量分数分别为55%和45%)样品阵列。
2.
The research results about optimization of anti-corrosion zinc-based alloy films by a combinatorial material chip technology in our research group are also reported for a fast screening purpose.
此外还介绍了本课题组近几年来使用组合材料芯片技术快速制备和筛选Zn基耐蚀合金镀层所取得的成果。
补充资料：材料界面(见材料表面)
材料界面(见材料表面)
interface of materials
材料界面interfaee of materials见材料表面。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条