1)  thermoplastic polyimide
热可塑聚酰亚胺
1.
On the basis of this procedure,three-layer polyimide films were prepared with thermoplastic polyimide on the surface layer.
逐层涂覆,制备了表面为热可塑聚酰亚胺的三层聚酰亚胺复合膜,与铜箔热压复合制备了双面覆铜挠性印制电路基板。
2)  thermoreversibility
热可逆性
1.
Study on thermoreversibility of phenol formaldehyde resin-borate hydrogels;
甲阶酚醛树脂-硼酸盐水凝胶的热可逆性研究
3)  thermally reversible
热可逆
1.
Five systems of thermally reversible covalent crosslink were reviewed in the present paper.
总结了热塑性弹性体中的 5类热可逆共价交联反应 ,介绍了其具体内容及研究进展。
4)  Thermally erasable
热可擦
5)  thermal reliability
热可靠性
1.
Simulation of thermal deformation is significant to enhance thermal reliability of electronic devices.
电子器件热变形的模拟对于提高器件的热可靠性有着重要意义 。
2.
Development of high heat flux chips requires better heat dissipation performance and higher thermal reliability of the electronics packaging, meanwhile, the miniaturization tendency and portability demand of the electronics packaging accelerate the research on the air-cooling technology.
高热流密度芯片发展要求封装器件具有更好的热耗散能力和更高的热可靠性;电子产品的小型化趋势及便携性要求则是空冷技术发展的助推剂。
6)  thermally compressible flow
热可压流
1.
This work refers to as the thermally compressible flow, the variable density flow due to temperature variation, with dimentionless heating number to describe its compressibility.
本文把由温度引起密度变化的运动流体称为热可压流，并由无因次加热数来度量其压缩程度。
参考词条
补充资料：聚芳酰胺酰亚胺纤维
分子式：
CAS号：

性质： 在芳酰胺中共聚入少量酰亚胺链节所纺成的纤维。密度1.43g/cm3，强度4.5～5.5GPa，伸长率3.4％，模量148～160GPa。阻燃性、耐热性、耐候性和耐腐蚀性优良。制法是将对苯二甲酰氯、对位芳族二胺与少量芳族酰胺酸类单体进行溶液缩聚和湿纺，经拉伸和热处理环化后而得。用于先进复合材料增强剂、轮胎和橡胶补强材料、特种缆绳和产业用布等。若采用改进共聚体，可用于高温气体滤袋和电绝缘纸。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。