1) vacuum deposition
真空热蒸镀
1.
A new multilayer structure blue organic light-emitting diode(OLED) has been developed by vacuum deposition technique.
采用真空热蒸镀技术,在不同的掺杂浓度下,制备了4种双异质型结构的蓝色有机电致发光器件(OLED),其结构为ITO/CuPc(30 nm)/NPB(40 nm)/TPBi(30 nm):GDI691(x%)/Alq3(20 nm)/LiF(1 nm)/Al(50 nm),其中x%为发光层掺杂浓度,分别取1、2、3和4%。
2.
A kind of multi-layer structure blue organic light-emitting diode(OLED) has been developed with TPBi as emitting host material by using vacuum deposition.
采用真空热蒸镀技术,以TPBi为蓝光主体材料制备了一类多层结构的蓝色有机发光二极管(OLED),其结构为:ITO/CuPc(30 nm)/NPB(40 nm)/TPBi(30 nm)∶GDI691(x%)/Alq3(20 nm)/LiF(1 nm)/Al(50 nm),其中x%为发光层掺杂浓度,实验中分别取1%,2%,3%和4%。
2) vacuum evaporation
真空蒸镀
1.
Large-scale fabrication by vacuum evaporation and characterization of TiO_2 thin films;
大规模真空蒸镀二氧化钛薄膜及其表征
2.
Effect of high magnetic field on Te films prepared by vacuum evaporation
强磁场对真空蒸镀制取Te薄膜的影响
3.
Aluminum film is produced on glass,H13 steel,plastic and pure Cu substrate by resistance heating vacuum evaporation,and the adhesive power of aluminum film is determined and analyzed.
采用电阻加热式真空蒸镀法在玻璃、H13钢、塑料和纯铜基体上镀制铝膜,并对其附着力进行了测试和分析。
3) vacuum evaporate plating
真空蒸镀
1.
The MH electrode was modified with a thin silver film using vacuum evaporate plating technology.
采用真空蒸镀的方法对贮氢合金电极进行了镀覆银膜的表面修饰。
2.
Through the investigating of the vacuum evaporate plating process:the rate of variation of evaporate transition current influencing on the filmy physical feature, giving that the rate of variation of transition current is one of the critical factors that influence the filmy physical feature, and explain its mechanism.
通过研究真空蒸镀工艺中预熔→蒸发过渡电流变化率对光控膜物理特性（ 附着力和耐磨性） 的影响，得出过渡电流变化率是影响蒸镀膜层物理特性的关键因素之一，并对其机理作了讨论。
5) vacuum vaporization method
真空蒸镀法
1.
The organic films are deposited by vacuum vaporization method.
采用直流磁控溅射法沉积阳极ITO薄膜,真空蒸镀法沉积有机膜,直流磁控溅射法沉积Al阴极,制备了8-羟基喹啉铝绿色OLED。
6) vacuum slowly vapor deposition
真空微蒸发镀覆
1.
Effects of vacuum slowly vapor deposition parameters on coating quality and diamond properties;
真空微蒸发镀覆工艺参数对镀层质量及金刚石性能的影响
补充资料：真空蒸镀
分子式：
CAS号：
性质：在真空中将镀料加热使其蒸发或升华，并沉积在镀件上的过程。常用的是电阻加热蒸镀。真空蒸镀可用来镀覆铝、黄铜、镉、锌等装饰或防护性镀层；电阻、电容等电子元件用的金属或金属化合物镀层；镜头等光学元件用的金属化合物镀层。
CAS号：
性质：在真空中将镀料加热使其蒸发或升华，并沉积在镀件上的过程。常用的是电阻加热蒸镀。真空蒸镀可用来镀覆铝、黄铜、镉、锌等装饰或防护性镀层；电阻、电容等电子元件用的金属或金属化合物镀层；镜头等光学元件用的金属化合物镀层。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条