1) immersion plating
浸泡镀敷
1.
The optical properties of transition-metal(copper)doped porous silicon by immersion plating in metal ion solutions(CuCl2)were reported.
采用浸泡镀敷的方法在多孔硅表面形成了一镀铜层,通过对掺铜前后多孔硅的光致发光(PL)谱和傅里叶变换红外(FTIR)吸收光谱的研究,讨论了铜在多孔硅表面的吸附对其光致发光的影响。
2) coating
[英]['kəʊtɪŋ] [美]['kotɪŋ]
浸涂、涂、敷、镀、包复、涂料
3) plating
[英]['pleɪtɪŋ] [美]['pletɪŋ]
(电)镀，镀敷
4) Immersion plating
浸镀
1.
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐,加入络合剂、光亮剂、锡盐稳定剂,研究成功了一种新的浸镀铜锡合金工艺。
2.
Use immersion plating to plate film on the glass.
以硝酸镍为起始原料,采用溶胶-凝胶法制得高稳定性的溶胶体系,用浸镀法在玻璃表面镀膜,研究了不同物质配比对溶胶稳定性和成膜性的影响,利用DTA、IR、XRD分析了凝胶和薄膜的结构,确定了氧化镍薄膜的制备条件;溶胶制备温度为60～80℃,pH=4,镀膜热处理温度为300～350℃,时间2h。
3.
In this paper, the characteristic, electrochemistry principle and technological controls of immersion plating depositions were reviewed, which are keen surface technology in electronic field.
本文介绍了当前电子行业热门的表面技术-浸镀处理的特点、机理及其工艺控制。
5) immersion
[英][ɪ'mɜ:ʃn] [美][ɪ'mɝʃən]
浸镀
1.
On the microstructure of immersion silver on sputtered copper;
溅射铜基材上浸镀银的微结构表征(英文)
2.
In the paper,the mechanism,rudimental process and surface morphology of the immersion silver and immersion tin on PCB are studied contrastively.
浸镀是印刷电路板(PCB)终饰工艺中的主流技术。
6) dip plating
浸镀
1.
The unfeasibility of dip plating of copper on iron and steel workpiece from a bright acid copper sulfate bath and the features of acid copper plating process characterized by the combination of dip plating with electrodeposition were analyzed.
分析了基于硫酸盐光亮酸性镀铜体系的钢铁件浸镀铜工艺工业化应用的不可行性,以及浸镀与电沉积相结合的酸性镀铜工艺的特点。
补充资料：敷敷
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参考词条