1) Al wire bonding
铝线邦定
2) ultrasonic Al wire bonder
超声波铝线邦定机
3) bonding
[英]['bɔndɪŋ] [美]['bɑndɪŋ]
邦定
1.
In the design of the semiconductor laser groupware,selection of lasers,design of an optical system and a laser circuit and the bonding technology are key factors.
在半导体激光器模组设计中,激光器选择、光学系统设计、激光器电路设计与"邦定"技术是模组设计的关键部分。
4) Droperidol
力邦欣定
1.
Droperidol Decreasing Nausea and Vomit in Epedural Analgesia after Morphine Operation;
力邦欣定减少吗啡术后硬膜外镇痛的恶心呕吐
5) bonding machine
邦定机
1.
During the process of designing COD bonding machine, this paper uses ANSYS to simulate and imitate the transformation of bonding machine s press part which is cause by heating, studies the displacement extremum of its key part.
COG邦定机是TET-LCD液晶模块生产线上的关键设备,主要用于IC片与显示屏的精确压接。
2.
Considering the motion control system as the object in ultrasonic Al wire bonding machine of IC-encapsulation equipment,this paper introduces the design method of motion control system based upon TMS320LF2407 and PCI bus.
以半导体后序封装设备中的超声波铝线自动邦定机为控制对象,介绍了一种基于TMS320LF2407DSP和PCI总线的运动控制系统设计方案,充分合理地利用DSP的软硬件资源,实现了对多轴电动机的精确控制,利用PCI9052实现与PC机的高速通信,并就该运动控制系统的硬件以及软件设计方案进行探讨。
6) COG Bonding Machine
COG邦定机
1.
Analysis on the Thermal-stain of Press Part on COG Bonding Machine with ANSYS;
基于ANSYS的COG邦定机压头热应变分析
补充资料：常州冶炼厂铝线坯连铸连轧生产线
常州冶炼厂铝线坯连铸连轧生产线
常州冶炼厂铝线坯连铸连轧生产线粉
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条