Research on wet etching technique for SiGe HBT emitter mesa for mation;

To avoid the under-cutting phenomenon caused by the anisotropy of wet etching technology in the machining process of micro accelerometer,mask patterns for compensation should be designed according to the requirement of etching speed and depth before corrosion,then perfect shape of convex corner can be obtained after a given etching time.

In this paper,the processing on wet etching,metal sputtering,sintering of source and drain contacts were discussed in detail.

In this paper, process parameters of micromachined pressure sensor are obtained through the research of fabrication process of silicon-based micromachined pressure sensor, especially the wet etching process of microcaves.

The wet-etching of GaAs in different chemical bathes is discussed.

Using bulk-silicon micro-mechanical technique by crystal characters of (110) silicon,in which photolithography,reaction ion etching,and wet-etching technique are included,micro-mirror,cantilever beam,torsion beam,and fiber orientation slots are fabricated simultaneously on (110) silicon.

SOI waveguides fabricated by wet-etching method are demonstrated.

Study on the etching process of aluminum foil for electrolytic capacitor;