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1)  lead coating
引线镀层
1.
The leakage failure mode and failure mechanism of the device due to silver migration caused by improper lead coating materials are discovered.
对漏电失效的塑封三极管,通过显微观察、去除异物前后的电性能对比分析、能谱成分分析等技术手段,揭示了因引线镀层材料采用不当引起银迁移致使器件漏电失效的失效模式及失效机理,并提出了相应的建议措施。
2)  gold plated lead
镀金引线
3)  lead plating
引线电镀
4)  tin plated copper wire
镀层铜线
5)  pin solderability deposit
引脚可焊性镀层
1.
Development of high speed electroplating additives of unleaded pure tin for pin solderability deposits;
引脚可焊性镀层无铅纯锡高速电镀添加剂的开发
6)  coating of steel wire cord
钢帘线镀层
1.
Determination of copper and zinc in the coating of steel wire cord by continuous titration with EDTA;
EDTA连续滴定法测定钢帘线镀层中铜和锌
补充资料:无针难引线
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