1) stress migration
应力迁移
1.
The effect of via size on the stress migration of Cu interconnects;
通孔尺寸对铜互连应力迁移失效的影响
2.
Residual stress distribution in Cu interconnects was analyzed using three-dimension finite element model to study the structure effect of stress migration failure.
为研究铜互连系统中各因素对残余应力及应力迁移失效的影响,建立了三维有限元模型,用ANSYS软件分析计算了Cu互连系统中的残余应力分布情况,并对比分析了不同结构、位置及层间介质材料的互连系统中的残余应力及应力梯度。
2) stress-migration
应力迁移
1.
The main purpose of this article is to study the reliability of copper/low-k interconnects, especially on Electromigration and Stress-migration failure.
本文研究了Cu/低k互连系统可靠性,包括Cu互连的电迁移和应力迁移失效问题。
3) shift stress
迁移应力
4) stress moving method
应力迁移法
6) stress migration test
应力迁移试验
补充资料：轧辊残余应力(见轧辊应力)
轧辊残余应力(见轧辊应力)
residual stresses in roll
zhagun eanyu yingli轧辊残余应力(residual stresses in roll)见礼辐应力。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条