1) substrate thickness
基板厚度
2) substrate
基板
1.
Research and Application of Glass-Ceramic Substrates for Hard Disk;
硬盘用基板微晶玻璃的研究与应用
2.
Study of Laser Cutting Technology for Mica Plate as Special Circuit Substrate;
特种电路基板云母片的激光切割工艺研究
3.
Research on the substrate materials of micro-strip gas chambers;
微条气体室基板研究(英文)
3) base plate
基板
1.
The applicability of using the CSP product to make the cold rolling base plate was mainly analyzed in this article.
从CSP设备、工艺及CSP产品的几何尺寸、组织和性能的角度分析了CSP产品做冷轧基板的适用性,并提出CSP产品做冷轧基板的一般要求。
2.
The solution to settle the problem of flash overflow of base plate during the packaging process of BGA products was proposed.
分析了BGA塑封模与传统集成电路产品塑封模的不同点,通过对BGA封装难点的分析,提出了BGA产品封装过程中出现的基板溢料问题的解决方案,并详细介绍了BGA塑封模溢料控制机构和具体实施方法。
4) ceramic plate
陶瓷基板
1.
To raise ozone output of ozonator,it demands that ceramic plate materials for ozonator have good dielectric properties and quite high thermal conductivity.
为了提高臭氧发生器的臭氧产量 ,要求臭氧发生器用的陶瓷基板材料具有较高的介电性能和热导率。
5) hard disk substrates
硬盘基板
1.
MgO-Al2O3-SiO2 glass ceramic is an excellent potential material for hard disk substrates with good mechanical properties,and it can essentially meet the requirements of hard disks with higher storage capacity and higher rotation speed.
MgO-A l2O3-SiO2系微晶玻璃是一种优良的磁盘基板备选材料,该材料具有良好的力学性能,能够满足高性能硬盘基板用材料的要求。
6) substrate temperature
基板温度
1.
Effect of substrate temperature on the structure and properties of SnO_2∶Sb films;
基板温度对SnO_2:Sb薄膜结构和性能的影响
2.
The influence of substrate temperature,substrate conveying speed and the flow rate of N2 on the structure and properties of the films was investigated.
研究了基板温度、基板输送速度和氮气流量对ATO薄膜结构和性能的影响。
3.
Kinetic Monte Carlo method was applied to simulate the relationship between substrate temperature and the microstructure of the thin film fabricated by means of physical vapor deposition(PVD),and its surface topography was studied by fractal theory.
采用动态蒙特卡罗(KMC)方法研究物理气相沉积(PVD)制备薄膜过程中基板温度对薄膜微观结构的影响,并用分维理论研究薄膜表面的复杂程度。
参考词条
补充资料：板带厚度测量
板带厚度测量
thickness measurement of plate and strip
bondai houdu eeliang板带厚度测量(thiekness measurement ofpfate and strip)指板带厚度尺寸的在线实时测量。这是提高成品率，保证板带材产品质量的重要措施，是实现生产过程自动化不可缺少的重要环节。(见厚度自动挂制) 板带厚度的在线测量可分为接触式测量和非接触式测量两类。接触式测量按工作原理分为电感式、差动变压器式、角位移式、磁栅式等。非接触式测量按工作原理分为射线式、微波式、激光式、气动式、涡流式等。在生产过程中，选用哪种测量方式，取决于板带的材质和生产过程工艺所提出的技术要求。非接触式测量得到广泛采用。 中国在2。世纪50年代开始对测厚仪进行了研究，现在已有了各种类型的测厚仪，对轧制生产线的自动控制起了很大的促进作用。各种类型测厚方法的仪器、应用范围和产地如表所列。 各种测厚仪器的性能、特点和应用扭李 (李由婉)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。