1) PZT/ZnO composite ceramics
PZT/ZnO复合陶瓷
2) PZT ceramic
PZT陶瓷
1.
Investigation of the ferroelectric domain of PZT ceramic;
粗大晶粒PZT陶瓷中电畴的结构
2.
Electroless plating of nickel is an advanced metalizing PZT ceramic technology.
化学镀镍是一种先进的PZT陶瓷覆镀电极层的技术,其镍层附着力大小是影响电极层质量的关键因素。
3.
Through analyzing effect on electric properties of PZT ceramic made by forming pressure, sintering temperature and soaking time, it was identified that compact ceramic could be obtained at forming pressure of 200 MPa, sintering temperature of 1200℃and soaking time of 2 h.
重点研究粉体的原料配比、烧结特性和陶瓷的烧成温度、成型压力﹑恒温时间及Nb~(5+)掺杂前后对PZT陶瓷压电、介电性能的影响。
3) PZT ceramics
PZT陶瓷
1.
Internal friction due to the interaction between oxygen vacancies and domain boundaries in PZT ceramics;
PZT陶瓷中由氧空位与畴壁相互作用引起的内耗
2.
The Large Field-induced Strain Effects on Modified PZT Ceramics;
改性PZT陶瓷的大场诱应变效应
4) composite ceramics
复合陶瓷
1.
Preparation of TiN-SiC composite ceramics by reactive hot-pressing;
反应热压法制备TiN-SiC复合陶瓷材料
2.
Study on the structure and properties of LaCrO_3-NiMn_2O_4 composite ceramics;
LaCrO_3-NiMn_2O_4复合陶瓷材料结构与性能的研究
3.
Preparation and dielectric property of Sr_xBa_(1–x)Nb_2O_6-Sr_(0.6)Ba_(0.4)TiO_3 composite ceramics;
SrBaNb-SrBaTi复合陶瓷的制备和介电性能研究
5) ceramic composite
复合陶瓷
1.
In this paper using TiN, Al and BN as raw materials, reactive hot presing method wasproposed to produce TiB2/AlN ceramic composites.
本文报道了以TiN、Al和BN为原料通过反应热压法制备TiB2／AlN复合陶瓷的实验结果，对该反应的热力学过程，产物的物相、微观结构与形貌进行了研究与讨论。
2.
The mechanism of particulate dispersion strengthening ceramic composites were discussed.
论述了颗粒弥散强化陶瓷基复合陶瓷的机理，叙述了第二相颗粒补强钛酸铝基复合陶瓷的国内外研究状况。
3.
A series of samples of hexagonal boron nitride-aluminum nitride (0~100, 5~95, 10~90, 15~85, 22~82, 70~30wt%) ceramic composites were prepared by hot-pressing in nitrogen gas at 1850℃ for 2 h, with reagent grade Y2O3 and CaCO3 as sintering aid.
用热压工艺制备一系列BN含量(质量分数)为0~30%的AlN-BN复合陶瓷材料,研究了三氧化二钇和碳酸钙添加剂对致密性及介电性能的影响。
6) ceramic composites
复合陶瓷
1.
Microstructure and dielectric properties at low frequency of BaWO_4/(Ba,Sr)TiO_3 ceramic composites
BaWO_4/(Ba,Sr)TiO_3复合陶瓷的显微结构与介电性能
2.
A series of samples of AlN-BN ceramic composites with different contents of sintering additives CaF_2(0-4wt%) were prepared by hot-pressing in nitrogen atmosphere at 1850℃for 3h.
用热压工艺制备了AlN-BN复合陶瓷材料,研究了不同含量CaF_2烧结助剂对致密化、介电和热导性能的影响。
补充资料：玻璃陶瓷基复合材料
分子式：
CAS号：
性质：又称微晶玻璃基复合材料。以玻璃陶瓷为基体，以陶瓷、碳、金属等纤维、晶须、晶片为增强体，通过复合工艺所构成的复合材料。玻璃陶瓷基复合材料的基本材料主要有锂铝硅微晶玻璃(LAS，1000～1200℃)、镁铝硅微晶玻璃(MAS，1200℃)、钡镁铝硅微晶玻璃(1250℃)、四元莫来石(约1500℃)和六方钡长石(约1700℃)等。玻璃陶瓷基复合材料的力学性能特别是韧性比原基体材料确实有较大的提高。例如用连续纤维增强玻璃陶瓷其强度范围为700～1000MPa·ml／2。而原基体材料的强度范围为70～150MPa，断裂功2～4J·m-2，断裂韧性为1MPa·m1/2以下。制造小型雷达天线罩、复合装甲、耐腐蚀化学品容器、生物医药用容器和耐热部件等。
CAS号：
性质：又称微晶玻璃基复合材料。以玻璃陶瓷为基体，以陶瓷、碳、金属等纤维、晶须、晶片为增强体，通过复合工艺所构成的复合材料。玻璃陶瓷基复合材料的基本材料主要有锂铝硅微晶玻璃(LAS，1000～1200℃)、镁铝硅微晶玻璃(MAS，1200℃)、钡镁铝硅微晶玻璃(1250℃)、四元莫来石(约1500℃)和六方钡长石(约1700℃)等。玻璃陶瓷基复合材料的力学性能特别是韧性比原基体材料确实有较大的提高。例如用连续纤维增强玻璃陶瓷其强度范围为700～1000MPa·ml／2。而原基体材料的强度范围为70～150MPa，断裂功2～4J·m-2，断裂韧性为1MPa·m1/2以下。制造小型雷达天线罩、复合装甲、耐腐蚀化学品容器、生物医药用容器和耐热部件等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条