This paper investigated the influence of abrasive size,load and spindle speed in grinding process on surface/subsurface damage of Nd-doped phosphate glass experimentally.

A molecular dynamics(MD) simulation is carried out to analyze the effect of cutting edge radius,cut-depth,and grinding speed on the depth of subsurface damage layers in monocrystal silicon grinding processes on an atomic scale.

For the subsurface damage layer of optical materials in grinding process, a combined method of MRF spot technique and HF acid differential chemical etch rate method was proposed to measure the depth of subsurface crack layer and thickness of residual stress layer.

Investigation of intelligence quotient,psychomotor development,and subclinical impairment in schoolchildren from areas with various degrees of iodine deficiency;

Objective To investigate the subchronic injury of mammal thyroid function caused by Prochloraz.