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1)  semiconductor thermoelectric module
半导体热电堆
1.
In this paper,an experiment for generating performance of semiconductor thermoelectric module is carried out,and some useful results are obtained.
半导体热电堆的发电性能进行了实验研究 ,得出这种半导体热电堆在冷端温度不变的情况下 ,其发电性能与热端温度的关系 ,以及半导体热电堆在热端温度不变的情况下 ,冷端温度对其发电性能的影响 ;发现半导体热电堆作为电源时 ,其内阻对它的性能指标有很大的影响 ,而且内阻随着温度的升高而增大。
2)  thermoelectric modules
半导体热电堆
1.
This paper establishes one-dimensional unsteady heat conduction equation of semiconductor thermoelectric modules and numerically calculates temperature distribution using Binder-Schmidt explicit method that can coincide well with experimental results.
本文建立了低温半导体热电堆的一维非稳态导热方程 ,并采用Binder -Schmidt显式方法 ,对低温热电堆内部温度分布进行了数值计算。
2.
A set of water-water experimental equipment was established to determine thermal performance of semiconductor thermoelectric modules under low temperature, based on which performance curve of power generation was obtained.
建立了测定半导体热电堆发电性能的水-水换热实验装置,并进行了低温差条件下的热电发电实验,获得了稳定状态下的热电堆发电性能曲线。
3)  thermoelectric module
半导体热电致冷堆
1.
An temperature control system for fabrication of plastic chips which is based on thermoelectric module for heating and cooling was designed;the power of heating/cooling in hot embossing and the necessity of circulation water for assistant cooling were analyzed;aiming at the characteristic of thermoelectric module,a convenient for indust.
本文采用半导体热电致冷堆,设计了适合塑料芯片制作的温度控制装置;分析了升降温过程中所需的加热/制冷功率,并对升降温特性进行了研究;设计了半导体热电致冷堆供电电源装置。
2.
In this dissertation, based on the analysis of the development of the fabrication technology for microfluidic chips, a temperature control system has been developed, which is based on thermoelectric module for fabricating plastic microchannel by hot embossing.
本文在分析塑料微流控芯片制作技术的基础上,针对目前热压成形技术制作塑料微通道的特点,采用半导体热电致冷堆作为加热/致冷器件,研制了用于塑料微通道热压成形的温度控制系统,并对该系统的性能进行了分析和实验验证。
4)  thermoelectric semiconductor
热电半导体
5)  semiconductor thermoelectric material
半导体热电材料
6)  semiconductor TE
半导体热电模块
补充资料:热电堆
分子式:
CAS号:

性质:一种温度测量元件。由两个或多个热电偶串接组成,各热电偶输出的热电势是互相叠加的。用于测量小的温差或平均温度。

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