An temperature control system for fabrication of plastic chips which is based on thermoelectric module for heating and cooling was designed;the power of heating/cooling in hot embossing and the necessity of circulation water for assistant cooling were analyzed;aiming at the characteristic of thermoelectric module,a convenient for indust.

In this dissertation, based on the analysis of the development of the fabrication technology for microfluidic chips, a temperature control system has been developed, which is based on thermoelectric module for fabricating plastic microchannel by hot embossing.

In this paper,an experiment for generating performance of semiconductor thermoelectric module is carried out,and some useful results are obtained.

This paper establishes one-dimensional unsteady heat conduction equation of semiconductor thermoelectric modules and numerically calculates temperature distribution using Binder-Schmidt explicit method that can coincide well with experimental results.

A set of water-water experimental equipment was established to determine thermal performance of semiconductor thermoelectric modules under low temperature, based on which performance curve of power generation was obtained.

This paper analyzes the work state of a semiconductor refrigeration miniature airconditioning fan and derives the work state parameter equations.

An integrated high-power LED using semiconductor refrigeration technology to dissipate heat is introduced.

According to the characteristic of the semiconductor refrigeration,the semiconductor refrigeration technology will be applied in the medicine semiconductor refrigeration and the optimum state parameter formula of the medicine refrigeration is given in the paper.