1) Algorithm of tracing by every vertex
逐点描迹法
2) scan point by point
逐点扫描法
3) multi-point scan
逐点扫描
1.
For the wafers prepared by multi-wire saw process,the warp distribution was measured with multi-point scan.
采用逐点扫描法对多线切割制备的晶片翘曲度分布进行了测量。
4) sequential sweeping method
逐列扫描法
5) pixel level algorithm
逐点算法
6) curve tracing
曲线描迹(法)
补充资料:逐迹
1.追踪。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条