1) metal substrate
金属基板
1.
Electronic speckle pattern interferometry (ESPI) and finite element method (FEM) calculation have been used to investigate the thermal failure behaviors of the metal substrate in electronic packaging.
本文将电子散斑干涉与有限元数值计算相结合,对金属基板结构的热失效行为进行了研究。
3) flexible metal substrate
柔性金属基板
4) insulated metal substrate
绝缘金属基板
1.
Study on pre-treatment process of ideal insulated metal substrates;
理想绝缘金属基板前处理工艺的研究
5) metal base printed board
金属基印制板
6) metal base copper clad laminate
金属基覆铜板
1.
White copper clad laminate and metal base copper clad laminate made from the film were used in LED base material.
这种薄膜在制成白色覆铜板及金属基覆铜板后,在LED基板制造中得到了应用。
补充资料：Ti_(3)Al基合金(金属间化合物)涡轮导风板
Ti_(3)Al基合金(金属间化合物)涡轮导风板
TiaA，基合金(金属间化合物)涡、、风*。利;:，
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条