1) channel aspect ratio
通道深宽比
2) high aspect ratio
高深宽比
1.
Simplified microfabrication technology for producing SU-8 microstructures with high aspect ratio;
高深宽比SU-8微结构的简易加工技术
2.
Dry etching technique for silicon of high aspect ratio in MEMS device fabrication;
MEMS器件制造工艺中的高深宽比硅干法刻蚀技术
3.
A key problem was analyzed in the electrical discharge machining(EDM) of the high aspect ratio micro-structures.
针对电火花加工高深宽比微细结构时放电间隙小、加工产物不易排除的技术难题,在分析电火花加工电蚀产物稳定性的理论基础上,结合脉冲超声聚焦技术,提出了激波压力扰动辅助电火花加工高深宽比微细结构的方法,设计了激励电源和激波发生器试验装置,测试了相应的电功率和声功率。
3) aspect ratio
深宽比
1.
The effect of the aspect ratio,the width of the cavity,the duty ratio and friction coefficient on the deformation of the polymer was detailed analyzed.
详细分析了深宽比、凹槽宽度、占空比、摩擦系数对聚合物变形的影响。
2.
The results show that the aspect ratio is greater than 20∶1 and the angle of sidewall can be controlled well in the range of 90°±1°.
利用这组优化的工艺参数进行Si的干法刻蚀,所得到的微结构的深宽比将大于20∶1,同时侧壁垂直度能够很好地控制在90°±1°。
4) high-aspect-ratio
高深宽比
1.
Numericall Analysis on Mass Transport in Micro Electroforming of Micro Structures with High-aspect-ratio;
高深宽比微细结构电铸时传质过程数值分析
2.
In the proposed technology,a movable mask with low-aspect-ratio patterns was used to confine the area of electrodeposition dynamically in order to produce high-aspect-ratio metal microstructures.
针对金属微结构器件制造难的问题,提出了活动屏蔽膜板高深宽比微细电铸技术,通过屏蔽膜板动态地限制电沉积的区域,可以用低深宽比的膜板图形加工出高深宽比的金属微结构,并且免除了去胶等难题。
3.
Various processes of microstructures were studied to fabricate high-aspect-ratio winding coil on the stator coil of a planar micromotor.
为了在平面微电机有限大尺寸的定子上制作高深宽比结构的绕组线圈,对高深宽比微结构的制作工艺进行了研究,综合比较各方面因素,从中找出了成品率高、可重复性好、工艺步骤尽量简单的平面线圈制作工艺,即在硅沟槽里通过微电铸得到高深宽比平面铜线圈的深刻蚀成型电铸工艺,并分析了光刻工艺关键参数之间的关系及对后续工艺的影响。
5) Width-To-Depth ratio method
宽深比法
1.
Three methods including Bankfull Discharge method,Width-To-Depth ratio method .
收集整理了松花江中下游江桥至富锦8个水文站33 a的流量、输沙率、实测大断面等项水文资料,采用平滩流量法、宽深比法、马卡维耶夫法进行造床流量的分析计算。
6) high aspect ratio(HAR)
深高宽比
1.
Unlike the etching process for conventional devices, some special problems will happen in the dry etching process for high aspect ratio(HAR)microstructures, such as RIE lag, etching stop, local bowing and notching effect.
介绍了深高宽比微结构在干法刻蚀过程中遇到的刻蚀滞后、刻蚀中止、侧壁弯曲和开槽效应等与传统器件刻蚀不同的现象,讨论了制作高深宽比结构所需的关键技术和检测手段。
补充资料：外宽内深
1.谓外貌宽厚而实则城府很深。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条