Black Adhesive for Soft Sealed Package of IC;

Selection of Tester for IC Used in Machine Tools;

Modeling of IC Controllers for Switching Mode Power Supply in SIMPLIS Environment and Its Application;

Analysis and simulation of joule heat effect of interconnect via in integrate circuit;

This paper surveys robotic wafer handling system for integrate circuit manufacturing,and reviews the operating principle and research results of the main components of the system,i.

This article introduces the methods of checking integrate circuit module and single crystal transistor.

Post CMP cleaning technology in the fabrication of integrated circuits;

Test Generation for Integrated Circuits at Register Transfer Level;

In order to study the EMP damage effects of integrated circuits exposed to EMP pulses with complex wave shape,several resistance and capacitance discharge networks were adopted in an ESD simulator to generate different ESD pulses.

Design of integrated circuit positive sequence component and negative sequence component filter;

Development of the automatic loader system for plastic package of integrated circuit;

Self-heating effects in integrated circuits with hot spot and electro-thermal coupling methods;

Research Progress on VLSI Thermal Aware Design;

AN APPLICATION OF BIPATITE CONNECTIONIST MODEL IN VLSI HIERARCHICAL GLOBAL ROUTING;

X ray lithography is a main candidate for printing sub 0 1μm features needed for very large scale integrated circuits(VLSI) at the beginning of the next century.