说明:双击或选中下面任意单词,将显示该词的音标、读音、翻译等;选中中文或多个词,将显示翻译。
您的位置:首页 -> 词典 -> 电子装配
1)  Electronic assembly
电子装配
1.
Electronic assembly process planning, especially the PCA (Print Circuit Assembly) process planning concerns much skill and knowledge.
电子装配工艺设计,尤其是印制电路板组装(PCA)工艺设计是一项知识性、经验性很强的工作,为提高电子装配工艺编制效率、改善工艺管理状况,本文建立了基于知识的电子装配CAPP系统。
2.
The functions of manufacturing execution system (MES) of electronic assembly industry such as the real-time visualization,dynamic schedule,production process track,configurablility and integration are discused.
电子装配行业的特点要求电子装配行业MES系统实现实时可视化、动态生产排程、装配过程跟踪等功能,同时实现系统可配置、可重构、实时、可集成等。
2)  electronic colour separating device
电子配色装置
3)  molecular assemblage
分子装配
4)  sub-assembly
子装配体
1.
Based on the precedence matrix among parts in the lowest level,algorithms to detect and verify the serial sub-assembly as well as parallel sub-assembly were developed.
对计算机自动装配规划进行了研究,从最底层零件间的优先关系矩阵出发,研究了串联、并联子装配体的识别和检验算法、高层装配体间的优先关系收缩矩阵算法以及装配系列的自动生成算法。
2.
Meanwhile,based on the information of the function structural tree and its parts of the production,the sub-assembly was judged by dividing the assembly relation graph and matching the rule.
利用产品功能结构树和零部件的信息,采用基于装配关系图分割的几何推理和基于规则的知识推理的方法来简化工艺子装配体的识别,以此生成装配结构树。
5)  subassembly [英]['sʌbə'sembli]  [美][,sʌbə'sɛmbli]
子装配
1.
Identifying subassembly of obvious features in advance, the liaison fig of product is decomposed by cut-set.
该方法在子装配或组件预识别的基础上,采用割集法将产品进行拆分,在零件几何优先关系建立的基础上,基于人机交互建立产品工艺优先关系。
6)  subassembly [英]['sʌbə'sembli]  [美][,sʌbə'sɛmbli]
子装配体
1.
The research on subassembly detection in assembly sequence plan;
装配顺序规划中子装配体的识别方法研究
2.
Facing to the difficulties in manual judging subassembly unstability that usually appears in assembly process planning,unstability discrimination and clamping scheme selection were provided to help engineers to plan the assembly process of subassembly.
针对装配工艺规划中大量存在的非稳定子装配体及其人工判断困难的问题,提出了非稳定子装配体的判别方法及其装夹方案的选择方法。
3.
The algorithm of the subassembly division is proposed according to subassembly definition and matrix expression for the assembly structural information.
根据子装配体的定义和装配结构信息的矩阵表达,提出了划分子装配体的算法。
补充资料:电子-电子双共振
      在垂直静磁场H的方向,施加两个微波电磁场:①较弱的微波电磁场,激发电子从能级2向能级3跃迁,不致于饱和;②强的微波电磁场,激发电子从能级1向能级4跃迁,使达到饱和,从而导致能级4的电子转移至能级3,以观察反映2→3跃迁的电子自旋共振信号强度的变化,故称为电子-电子双共振。它与电子-核双共振不同之处是不涉及核的跃迁,并且观察的与电子自旋共振有关的能级和未观察的跃迁能级之间无共享的公共能级。
  

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条