1) solidification layer on wall of cavity
模壁凝固层
2) solid wall model
固壁模型
3) coating
[英]['kəʊtɪŋ] [美]['kotɪŋ]
凝固涂层
1.
A new compound micro-membrane filter media with good anti-contamination was developed by the gel coating which could reduce the aperture of woven filter media and simplify their pore structure so as to prevent the filter media clogs.
根据减小孔径和改善接触滤饼侧的过滤介质孔隙结构有利于减轻介质污染的原则 ,利用凝固涂层的方法开发出一种具有良好防污性能的微孔薄膜复合过滤介质。
2.
A compound micro - membrane filter medium with some excellent properties was developed by coating method.
介绍了利用凝固涂层的技术研制出综合性能良好的微孔薄膜复合过滤介质,其中的薄膜具有良好的弹性,能完全匹配基布的各种力学形变,且与基布黏合良好。
4) solidified layer
凝固层
1.
The influences of the temperature, speed and deformation ratio of rolling during producing composite stainless steel band by inversion casting on the bonding between the mother band and solidified layer were investigated.
针对用反向凝固法生产不锈钢复合带的工艺,研究了轧制温度、轧制速度及轧制变形率对母带与凝固层间结合的影响。
2.
Variations of the thickness of the solidified layer as a function of time,volumetric flow rate and mold temperature was presented.
根据连续性、动量和能量守恒方程,以及固/液界面上能量平衡原理,建立了考虑凝固层后的一维流动模型。
5) Solidification simulation
凝固模拟
1.
Solidification Simulation for HSi80-3 Silicon Brass Rudder Bonnet;
HSi80-3硅黄铜船用舵盖铸件精铸工艺的凝固模拟
2.
Concurrent Visualization of Solidification Simulation;
凝固模拟并行可视化研究
3.
Determination of boundary heat-transfer coefficient for casting solidification simulation;
铝铸件凝固模拟边界热交换系数的测定
6) solidification model
凝固模型
1.
Then using solidification model and aim temperature curve,secondary cooling system ofΦ400mm round bloom is developed successfully in curved caster,the quality of round billet strand is qualified by macrostructure examination.
通过建立了圆坯凝固数学模型,并使用现场测量数据修正模型中的传热系数,使模型计算结果更加准确;然后应用凝固模型并结合铸坯目标温度曲线,成功开发了Φ400mm铸坯的二冷配水制度。
2.
According to three-dimensional dynamic solidification model of billets, temperature dynamic regulation process could be displayed when process parameters variation.
方坯连铸三维动态凝固模型能够真实反映工艺参数变化时的温度动态调节过程,考虑数值求解计算量大和计算速度慢等难题,改变铸坯横断面节点和单元网格的人工生成模式为自动生成模式,采用密度函数和网格质量评价函数,控制节点和单元网格及优化网格形状以保证网格划分的合理性;引入单元节点商和节点商及节点最大最小编号为约束条件的优化方法优化节点编号,缩小带宽节约存储空间。
补充资料：凹模壁厚及凹模垫板尺寸
型腔壁部投影面积 壁 厚， 毫 米
F， 厘米2 h1 h2 h3 h4 h5
<5 15~20 30~40 <=10 15~20 30~40
>5~10 20~25 40~50 10~15 20~25 40~55
>10~50 20~30 50~60 15~20 20~30 55~65
>50~100 30~35 60~75 20~25 30~40 65~70
>100~200 35~40 75~85 25~30 40~50 70~75
>200 >40 >85 30~35 50~60 >80
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条