When solid solution temperature exceeds 1 100 ℃,the grade of grain size and the strength at room temperature decreases with the increasing of solid solution temperature.

Study on new two-component room temperature curing acrylate adhesive;

aration of Room Temperature Curing Bicomponent PU Pouring Sealant;

Study on synthesis and performance of flexible curing agent for room temperature curing epoxy resin adhesive;

Heat-resistant modification epoxy construction adhesive curing at room temperature;

Study on high properties adhesive with curing at room temperature;

In order to improve the brittleness of epoxy resin after curing,a waterborne epoxy curing agent with toughness curing at room temperature was synthesized.

Study on preparation and properties of heat-resistant epoxy adhesive cured at room temperature;

Research present state and development of heat-resistant epoxy adhesive cured at room temperature;

Aiming at the defect of poor heat-resistant of adhesive used in the reinforced technique of RC structure with Carbon Fiber Reinforced Plastic,this paper summarized the current situation of the heat-resistant structural adhesive cured at room temperature and enumerated the newest research progress.

Study of Mechanical Properties of RTV Silicone Sealant Modified by Carbonyl Iron Powder;

Study on one-component condensating type RTV fluorosilicone adhesive;

Study on water-based RTV silicone rubber having self-catalytic crosslinker;