1) Cu Cr contact material
铜铬合金触头
2) copper-chromium contact
铜铬触头
1.
This paper describes the microstructure of copper-chromium contact and forming mechanism, the process factors affecting the crystallized structure as well as the influence of microstructure on electric properties.
论述了铜铬触头的金相组织与形成机理、金相组织对电气性能的影响及影响结晶组织的工艺因素,阐明了电弧熔炼法铜铬触头材料具有铬在铜基体中呈均匀细小弥散分布的铜铬组织;在开断能力、抗熔焊性、介质恢复强度等电气性能方面均明显优于传统粉末冶金法铜铬触头材料。
3) CuCr alloy
铜铬合金
1.
Effect of vacuum casting process on microstructure and properties of CuCr alloy;
真空熔铸工艺对铜铬合金组织与性能的影响
2.
The vacuum melting technique of some high chromium CuCr alloys in vacuum induction furnace was discussed and the absorptivity of Cr , the distribution and form of pre-eutectic Cr phase in Cu matrix were investigated.
探讨了高铬含量铜铬合金的真空熔炼工艺 ,重点讨论了铬的吸收率随配比中铬含量的变化关系 ,以及先共晶铬相的分布及形
3.
The effects of the additive CaF2 and preheating temperature of mold on the SHS reaction by which the CuCr alloy was prepared and its properties were investigated.
考察了添加剂CaF2及铸模预热温度等因素对自蔓延反应过程及合金性能的影响,分析了铜铬合金的金相组织及其化学成分,采用XRD技术对铜铬合金和熔炼渣进行了表征。
4) Cu-Cr alloy
铜铬合金
1.
The relationship between microstructure,mechanical properties and conductivity of Cu-Cr alloy material with cold deformation was investigated in the paper,together with the reason of wire fracture.
实验研究了拉拔变形程度与亚微米晶铜铬合金显微组织、力学性能和导电性能的关系,并分析了拉拔过程中断丝的原因。
2.
The corrosion behavior of cold rolled Cu-Cr alloy in humid air containing trace SO2 was investigated using scanning electron microscopy(SEM) and X-ray photoelectron(XPS).
采用SEM、XPS等测试方法,研究了铜铬合金在二氧化硫环境中的腐蚀情况。
3.
Cold deformation and heat treatment have been studied through testing mechanical property and conductivity of Cu-Cr alloy,and strengthening mechanism has been presented in the paper.
通过测试力学性能和导电性能,对铜铬合金进行了冷变形及退火工艺的探索,并进行了强化机理分析。
5) Cu-Cr alloys
铜铬合金
1.
Cu-Cr alloys with different mass percentages of chromium were prepared by equal channel angular pressing(ECAP).
制备不同质量百分含量铬的铜铬合金试样,对合金试样进行等径角挤压(ECAP)处理。
6) CuCr contact materials
铜铬触头材料
补充资料：铜头
1.指蝼蛄。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条