This method combines fringe projection method and digital image correlation method into one optical system,which is a novel method for measuring 3-D profile and out-of-plane displacement of micro structures.

Using 3-D topography measurement of microelectronics substrate as the background,this paper studied the mechanism and method of accurate measured mechanical quantity through Moiré fringe,which provided a non-contact,high-speed and high-accuracy measuring technique for the microelectronics substrate and for other information products(like shadow mask).

The results show that a three-dimensional topography(3D topography) of pearlite can not only be observed,but a clear judgment about the orientation of the lamella pearlite can be achieved as well.

The system was made up of some measuring modules constituted by sensors to inspect 3D topography of different work faces of the BWS.

A novel measurement system of micro-3D profile based on image fiber;

Using shadow-moire to determine 3D-profile can not only distinguish the outline of object directly,but also can get the real value of 3-dimension.

Using shadow-moire to determine 3D-profile could not only distinguish the outline of an object directly,such as to detect symmetry and inspect defects,but also get the actual value of 3-dimension.