1) plating
[英]['pleɪtɪŋ] [美]['pletɪŋ]
镀
1.
The deposition parameters, structures and element distribution of electroless Ni-Mo-P deposits, which were obtained from plating baths containing tartrate-lactic acid as complexing agent, were studied.
对自酒石酸盐-乳酸为络合剂体系的镀液中制得的Ni-Mo-P合金镀层的参数、结构及元素分布进行了研究。
2.
In view of the traditional making technology of smooth limit gauge,a method of plating surface is put forward.
针对光滑极限量规传统的制造工艺,提出了表面镀层的方法,分析了工艺过程,通过 试制,达到了一定的效果。
2) brush copperplating
刷镀镀铜
1.
In this paper, the effects of process parameter of brush copperplating on the copper film for prevention of carburization were studied; the relation between the time of carburization and the minimun thickness of copper film for prevention of carburization was established.
研究了用刷镀镀铜防渗碳时的工艺参数对镀层防渗碳效果的影响 ,及渗碳时间与防渗碳所需的最小镀层厚度之间的关系。
4) covering-plating
镀覆电镀
1.
On the basis of studying the manufacturing technology of covering plating of diamond,the authors give a theoretical discussion on some problems which are apt to arise in manufacturing procedure of covering-plating of diamond.
根据对金刚石镀覆电镀生产技术的研究，将金刚石镀覆电镀生产技术工艺及生产工序中容易出现的问题，进行了理论探讨和论述。
5) Gold electroplate
电镀镀金
6) plating
[英]['pleɪtɪŋ] [美]['pletɪŋ]
(电)镀，镀敷
补充资料：镀
分子式：
CAS号：
性质：人工合成的锕系后元素。原子序数109。1982年联邦德国Darmstadt重离子研究所的G.Munzenberg和P.Armbruster等人在全粒子加速器上用58Fe轰击209Bi靶，通过核反应209Bi（58Fe，n）266Mt→262Bh→258Db→258Rh→SF，得到266Mt，半衰期为3.4ms。
CAS号：
性质：人工合成的锕系后元素。原子序数109。1982年联邦德国Darmstadt重离子研究所的G.Munzenberg和P.Armbruster等人在全粒子加速器上用58Fe轰击209Bi靶，通过核反应209Bi（58Fe，n）266Mt→262Bh→258Db→258Rh→SF，得到266Mt，半衰期为3.4ms。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条