Brief Explanation of the Reasons for the Rolling up of the Label Paper Produced with Pressure-Sensitive Emulsion Adhesive And the Methods to Prevent It;

Cause Analysis of Tinplate Warp and Our Countermeasures;

Investigation on warp and curl in selective laser sintering polymeric materials;

Solving the Problem of Warping in the Injection Moulding Parts through Computer-Aided-Engineering Technology;

An integrated simulation of residual stress and warpage for plastic injection molding;

Analysis of Warpage of Thin-walled Plastic Parts by CAE;

Nonlinear finite element analysis on electronic chip package warpage;