1) bubble nucleation
气泡核化
2) air bubble
气泡
1.
Measurement of effective permittivity for solution chemical reaction and analysis of air bubble effect;
液相化学反应介电常数的测量与气泡影响分析
2.
Formation for air bubble in cement paste and its influence on the strength;
水泥石气泡的形成及其对强度的影响
3.
On the prevention of air bubbles and sand grains in the surface of tunnel secondary lining;
浅谈隧道二衬表面气泡和泛砂质量通病的防治
3) gas bubble
气泡
1.
Modeling and analyzing of low pressure pipeline transients accompanying gas bubbles and cavitation;
伴随气泡和气穴低压管路瞬态的建模与分析
2.
Parameter identification of gas bubble model in pressure pulsations using genetic algorithms;
采用遗传算法对压力脉动过程中气泡模型参数的辨识
3.
The influence of casting speed,argon blowing flow and in- sertion depth of submerged nozzle on the distribution of gas bubble in mould is investigated by water modelling.
对热轧板孔洞缺陷形成的原因进行了分析,指出连铸过程操作参数控制不合理是产生该种缺陷的主要因素;利用水模试验研究了水口插入深度、拉速、吹氩量等因素对结晶器内气泡分布的影响,在此基础上提出了治理热轧板孔洞缺陷的措施,取得了较好的效果。
4) bubbles
气泡
1.
Modeling of Energy Distribution of Bubbles of Burning Fluidized Bed;
燃烧流化床气泡能量分布模型
2.
Thermodynamics Analysis of the Relationship Between Pressure and Fugacity of Methane in Hydrogen Attacked Bubbles;
氢蚀气泡内甲烷压力与逸度关系的热力学分析
3.
Study on back light-scattering property of bubbles in ship wake;
舰船尾流气泡后向光散射特性研究
5) void
气泡
1.
Study Development of Mechanism for Void Formation and Elimination During RTM Processing;
RTM工艺过程中气泡形成机理及排除方法研究进展
2.
The Application of Resin s Temperature Deference to the Void Problem;
树脂温差在解决气泡问题上的运用
3.
The literatures concerning void formation during resin transfer molding process were collected and reviewed.
总结了关于RTM(树脂压铸)工艺中气泡缺陷的文献报道,对RTM中气泡缺陷的形成机理、影响因素及各研究者提出的消泡方法、理论和模型进行了概述,同时对RTM工艺中气泡缺陷的研究现状给予充分关注,并对RTM缺陷研究的未来方向进行了展望。
6) bubble
气泡
1.
River system repair technology of super-micro bubble;
超微细气泡水体修复技术
2.
Coalescence time measurement of two bubbles and its influence factors;
双气泡间的聚并时间测量及其影响因素
3.
Simulation of bubble hydrodynamics in viscors liquid;
粘性液体中气泡流体力学特性的模拟研究
参考词条
补充资料：公理化方法(见公理化和形式化)
公理化方法(见公理化和形式化)
axiomatical method
gongllbuafangfa公理化方法化和形式化。(axiomatieal method)见公理
说明：补充资料仅用于学习参考，请勿用于其它任何用途。