1) metal copper powder
金属铜粉
2) copper-based metal powder
铜基金属粉末
1.
Mechanism of P element in selective laser sintering of copper-based metal powder;
磷元素对铜基金属粉末选区激光烧结作用机理
2.
Direct laser sintering of a multi-component copper-based metal powder,which consisted of a mixture of Cu,Cu-10Sn,and Cu-8.
对多组分铜基金属粉末(组分包括Cu、Cu-10Sn、Cu-8。
3) Cu-Ag bimetallic powder
铜银双金属粉
1.
The Cu-Ag bimetallic powder prepared with substitutional reaction method has antioxidation behavior at the room temperature.
采用置换反应法制备铜银双金属粉,使用EDTA代替氨水作Ag+的络合剂,并螯合分散Cu2+,一次性制备了具有常温抗氧化性能的铜银双金属粉。
4) Cu-based metal powder
铜基金属粉末
1.
Densification mechanism of multi-component Cu-based metal powderin selective laser sintering process;
多组分铜基金属粉末选区激光烧结致密化机理
2.
Selective laser sintering of a multi-component Cu-based metal powder, which consists of high-purity Cu, pre-alloyed CuSn and CuP, has been successfully processed basing on liquid phase sintering mechanism.
对多组分铜基金属粉末(组分包括纯Cu,预合金CuSn和CuP)进行了选择性激光烧结试验,其成形机制为粉末部分熔化状态下的液相烧结机制。
3.
Experimental investigations on selective laser sintering(SLS) of multi-component Cu-based metal powder,which consists of pure Cu,pre-alloyed CuSn,and pre-alloyed CuP,were performed.
30 mm),对多组份铜基金属粉末(组份包括纯Cu,预合金CuSn和预合金CuP)进行了选区激光烧结(SLS)实验,其成形机制为粉末部分熔化状态下的液相烧结机制。
5) Cu-Ag bimetallic powder
铜-银双金属粉
1.
Research advance of preparing Cu-Ag bimetallic powder;
化学镀法制备铜-银双金属粉的研究进展
6) copper-soluble metal powder
铜溶金属粉末<冶>
补充资料：电解金属锰粉
分子式：MN
性状：熔点：1245°C，沸点：1962°C比重：7.2，原子量：54.938，表面呈银白色金属光泽或浅棕色。性硬而脆，在空气中氧化。还原性能很强，在空气中加热能燃烧生成MN3O4。用途：电解金属锰产品比电热法金属锰纯，质量好，用途更广泛。主要用于冶炼特殊合金钢、有色合金（铝锰、钛锰、锰镁合金）、不锈钢、电工钢、低磷低碳特殊钢。也用于化工、医药、食品、分析、科研等方面。质量：96－99.7％硫≤0.05％磷≤0.005％碳≤0.04％包装、储运：产品采用铝复合膜衬塑料袋真空包装，产品存放和运输应避免与酸、碱等化学物品接触，避免潮湿
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条