1) dual-surface method
双磨面
2) double-side grinding
双面磨削
1.
Using double-side grinding technology in 300 mm Si wafer manufacturing process,the Si wafer can obtain high accuracy surface parameters,and generate obvious grinding marks,which can affect the surface flatness.
在直径300mm Si片制备过程中,利用双面磨削技术能获得高精度的表面参数,但同时却会在Si片表面留下明显的磨削印痕,这会影响Si片表面平整度。
3) double-side lapping
双面研磨
1.
The dissertation was summarized home and abroad the glass substrate development present situation and the being problem , Elaborate double-side lapping process mechanism ?A two-step crystallized technology for crystallite glass is put forward in the pa.
本文概述了国内外玻璃基板发展的现状和存在的问题，阐述了双面研磨的加工机理。
4) double-sided wear
双面磨损
5) double-ended grinder
双端面磨床
1.
Analyzing characteristics of grinding zone during machining roller end with double-ended grinder;
双端面磨床加工滚子端面的磨削区特性分析
6) double disk surface grinding machine
双盘面磨床
补充资料：磨面伤[制革]
分子式：
分子量：
CAS号：
性质：革面磨得过深，各部分深浅不一致，砂纸过粗，用力不均匀等均能造成磨面伤。
分子量：
CAS号：
性质：革面磨得过深，各部分深浅不一致，砂纸过粗，用力不均匀等均能造成磨面伤。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条