1) Quasi solid Solidification Time
半固态凝固时间
2) semi-solidification
半固态凝固
3) solidification time
凝固时间
1.
The result shows that the DCS was found to be relevant to the thermal parameters such as solidification time,cooling rate and thermal gradient.
A201铝合金有127℃的宽凝固范围,适合作为研究对象;经有系统的改变冒口大小,及平板铸件的长度和厚度,可变化铝合金凝固时的各种热参数,例如:局部凝固时间、冷却速率、热梯度等,而经由DCS的计算,可得出其间的关系。
2.
The solidification time of the three supporting materials (carboxy-methyl cellulose, polyvinyl alcohol, starch) was discussed in the article.
作者对羧甲基纤维素、聚乙烯醇和淀粉3种支撑材料的凝固时间进行了实验研究。
3.
Based on the direct finite difference, a 3-dimensional numerical simulation model for quickly calculating the solidification time of casting to get the distributing rule of hot sport has been developed by casting modulus method and heat transfer method.
基于有限差分法 ,分别采用模数法和近似传热法实现了对任意形状铸件凝固时间的快速计算 ,由此可获得铸件的热节分布规律 ,为设计人员从铸件结构工艺性的角度校核结构设计的合理性以及为铸造工艺人员设计铸件的补缩系统提供了可靠依据。
4) setting time
凝固时间
1.
In the paper,the influences of different levels α-TCP to β-TCP ratio on cement's setting time and compressive strength are studied by optimizing α-TCP system cement's formula.
通过对α-TCP体系骨水泥固相粉末配方的优化,研究了不同重量比α-TCP/β-TCP粉末对两相骨水泥凝固时间和抗压强度的影响。
2.
The paper studys the effects of different types hardening liquid,different ratio of powder and liquid and different powder on the setting time and compressive strength of it,by optimizing the system of α-TCP phosphate cement,and chooses -HAP/α-TCP as better powder、citric acid+potassium citrate+propenoic acid-itaconae as good hardening liquid and 2.
通过对α-TCP体系骨水泥的优化,研究了不同固化液、不同固液比以及不同粉料对骨水泥凝固时间及抗压强度的影响,优选出了以n-HAP/α-TCP为固体粉料,以柠檬酸+柠檬酸钾+丙烯酸-衣康酸为复合固化液,按固液比2。
3.
Objective To explore the changes of setting time,mechanical properties and microstructrue of composite of various CPC-MTX,and to provide basic results of the bone filling materials that can suppress recur- rence of bone tumors.
目的研究加入不同浓度甲氨喋呤(MTX)对磷酸钙骨水泥(CPC)的凝固时间,力学强度及显微结构的影响,为进一步研制具有抗肿瘤复发作用的骨填充材料奠定基础。
6) Clotting-time method
凝固时间法
补充资料：凝固时间
分子式：
CAS号：
性质：用于制造半导体塑料封装的模料热固化所需时间。即在模塑温度下模塑料达到凝固而不能再进一步灌注模具所需的时间。
CAS号：
性质：用于制造半导体塑料封装的模料热固化所需时间。即在模塑温度下模塑料达到凝固而不能再进一步灌注模具所需的时间。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条