1) Gold powder
金粉
1.
The electroconductive adhesive is composed of modified phenol resin,mixture of platelet gold powder and sphericalgold powder, a small amount stibium powdr and alcohol solvent.
一种金导电胶，由改性的酚类树脂（NF）、片状金粉与球状金粉的混合粉末、少量锑粉和醇类为主的溶剂组成，固化温度范围150－300℃，体积电阻率5×10(-4)Ω。
2.
The paste is mainly composed of gold powder and organic vehicle.
这种浆料主要由金粉和有机载体组成。
2) flour gold
粉金
3) metal powder
金属粉末
1.
Discussion on the damage of metal powder to bus bar of insulation Al-smelting pots;
浅谈金属粉末对铝电解槽母线绝缘的危害
2.
State-of-the-arts in metal powder rapid prototyping;
金属粉末激光烧结快速原型制造技术发展现状
3.
Application and Developmeat of ultrasonic in nanosized metal powder preparation;
超声波在纳米金属粉末制备中的应用与发展
4) alloy powder
合金粉
1.
Iron-Based alloy powder of plasma arc surfacing for valve seal surface;
阀门密封面用等离子弧堆焊铁基合金粉末
2.
Effect of alloy powder on microstructures and mechanical properties of the K640 brazed joints;
合金粉对K640钎缝组织及性能的影响
3.
Preparation and properties of Al flakes and Al/Mg alloy powder
片状Al及Al//Mg合金粉的制备及性能
5) bimetallic powders
双金属粉
1.
Preparation of core-shell Cu-Ag bimetallic powders via electroless plating
化学镀法制备核壳型银-铜双金属粉
2.
Cu-Ag bimetallic powders whose grain size was similar to the copper powders,were prepared by reduction reaction with hydrazine as the reducing agent by means of inhibiting substitution reaction.
反应体系中引入强还原剂水合肼,通过反应条件的控制抑制置换反应,使银氨溶液优先发生液相还原反应,制备了与原铜粉粒径和形貌大致相同的铜-银双金属粉;采用XRD、EDX、激光粒度分析仪等检测方法对包覆双金属粉的晶相组成及含量、表面包覆层相组成及含量以及粒径分布等加以研究。
6) alloy powder
合金粉末
1.
Study on niobium-cobalt-rare earths alloy powder and its applications;
稀土铌钴合金粉末材料研究与应用
2.
Investigation on iron-nickel-rare earths self-fluxing alloy powder and its applications;
铁镍稀土自熔性合金粉末研究与应用
3.
Nanocrystalline Fe-Si alloy powders were prepared by high energy ball milling.
通过高能球磨法制备Fe75Si25纳米晶合金粉末,研究了高能球磨下的反应进程及产物,并讨论了合金粉末的微观结构和磁性能。
补充资料：金粉
分子式：
CAS号：
性质：见黄铜粉
CAS号：
性质：见黄铜粉
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条