1) throwing power
均镀能力
1.
64 times as that of the conventional technology, and the throwing power is increased 7.
６３８倍，均镀能力提高７。
2.
And raising the concentration of cuprous cya- nide as the main salt is helpful to increasing the current efficiency and throwing power and reducing the electroplating cost as well.
5g/L可以将碳酸钠浓度控制在工艺范围内;降低镀槽电压和增加阳极面积有利于降低碳酸钠的浓度;较高的主盐浓度可以提高镀液的电流效率和均镀能力,有利于降低电镀成本。
2) throwing power
均匀电镀能力
3) throwing power
均一电镀能力
4) levelling power
均镀力
5) covering power
深镀能力
1.
The process has greater covering power than cyanide copper plating process by comparison.
通过比较该工艺与氰化镀铜工艺的深镀能力,可知前者深镀能力明显优于后者。
2.
Throwing power,covering power,bright deposit current density range and cathodic current efficience of the bath were measured.
以碘酸钾、三氯乙酸、甘氨酸和甲酸为添加剂,加入到标准镀铬液中,测定了镀液的分散能力、光亮电流密度范围、深镀能力、阴极电流效率。
6) throwing power
深镀能力
1.
The results show that throwing power can be effectively improved in copper plating for the small holes of high aspect ratio PCB by taking bottom erupting way and clamp vibrating measures.
高厚径比PCB的电镀加工中,深镀能力越来越成为一个重要的评价指标。
2.
The throwing power of the bath is 100%.
试验结果表明,电流效率在90%左右,并随电流密度、温度和pH的提高而增大;镀液深镀能力达100%。
补充资料：均镀能力
分子式：
分子量：
CAS号：
性质：又称分散能力。指电镀溶液所具有的使镀层厚度在零件上均匀分布的能力。
分子量：
CAS号：
性质：又称分散能力。指电镀溶液所具有的使镀层厚度在零件上均匀分布的能力。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条