1) (Ti,Al)N films
(Ti,Al)N镀层
2) Ti/Al coatings
Ti/Al镀层
1.
Al, Ti/Al coatings on U substrates were prepared by repeated Ar+ bombardment-magnetron sputter ion plated (MSIP).
用循环Ar+轰击-磁控溅射离子镀(MSIP)法在U表面上镀Al,Ti/Al,并采用俄歇电子能谱仪(AES)、扫描电镜(SEM)、电化学实验和平面磨耗实验,研究了其表面、剖面形貌和耐磨耐蚀性能,以及Al/ U和Ti/Al镀层界面。
3) Ti-N coating
Ti-N镀层
4) (Ti,Al)N coating
(Ti,Al)N涂层
5) (Al,Ti)N coating
(Al,Ti)N涂层
6) (Ti.Al)N coating
(Ti,Al)N 涂层
补充资料:TC4(Ti6Al4V)焊接组织
TC4(Ti6Al4V)焊接组织
719
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