1) conduct piece
导电件
1.
On the basis of the technical analysis of the conduct piece,the feasibility in the proˉcessing of the progressive die for the piece and the difficulties in processing were determined.
通过对导电件零件的工艺分析,确定了采用级进模的工艺可行性及工艺难点,成功地设计并制造出具有多道弯曲的导电件多工位级进
2) Current carrying parts
导电零件
3) conducting part, conductive part
导电部件
4) conducting element
导电元件
5) photoconductive device
光电导器件
1.
The wafers were then made into photoconductive devices and the device characteristics were also studied.
采用移动加热器法(THM)进行了新型红外探测器材料 Hg1-x-yCdxZnyTe(MCZT)的晶体生长,获得的MCZT晶片经汞源退火后进行了光学特性、结构特性、电学性能和组分均匀性的检测与分析,并且初步制作成近室温工作的长波光电导器件,对器件性能进行了测试与分析。
6) outside conductive parts
外挂导电件
补充资料：半导体导电性(见半导体的导电与电荷输运)
半导体导电性(见半导体的导电与电荷输运)
electrical conductivity of semiconductor
半导体导电性eleetr、ea一conou以，v:‘，_‘ 一J一“。，瓜米早伙鼓幕由乌教着给话_
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条