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1)  characteristics of heat conduction
导热特性
2)  thermal conduction characteristic
热传导特性,导热特性
3)  thermal conductivity
导热性能
1.
Experimental study on thermal conductivity of mixed materials of sand and bentonite;
砂土混合材料导热性能的试验研究
2.
Finite element analysis of thermal conductivity of three dimensional and five directional braided composites;
三维五向编织复合材料导热性能的有限元分析
3.
In this paper, research was carried out on thermal conductivity of YSZ samples prepared through experiments.
鉴于YSZ陶瓷材料热物性研究的不完善性,本文对实验制得的YSZ试样进行了导热性能的研究。
4)  thermal conductivity
导热性
1.
Aiming at the laigh thermal conductivity of magnetic refrigerant materials(such as Gd),this paper presents a new technical scheme named vacuum diffusion bonding,which can improve its thermal conductivity.
针对室温磁制冷材料Gd本身导热系数低特点,提出了采用真空扩散焊方法改善Gd导热性能的成型工艺方案,在温度为550~620℃,压强为12~20Mpa,保温时间为30~120min条件下,实现了钆和铜异种材料连接,并比较了在钆基体上溅射一层铜薄膜和不溅射薄膜两种条件下的工艺性能。
2.
It was shown that the microstructure is uniform and compact, while the electrical and thermal conductivity is high for these composites.
SiC体积分数不超过15%的铜基复合材料具有比铬锆铜合金更高的导电、导热性能和耐磨性。
3.
The influences of foundry process factors,especially the melting proces s,solidification process and cooling condition,on thermal conductivity of cast i rons were analyzed in detail.
详细分析了铸造过程中的工艺因素,尤其是熔炼、凝固和冷却条件对铸铁导热性的重 要影响。
5)  heat conductivity
热传导性
1.
Mechanical properties, fluid permeability, acoustical properties, heat conductivity and damping capacity were tested by testing methods and testing units that we design.
研究渗流铸造泡沫铝合金的性能特点,自行设计测试方法和制造测试装置,测试了泡沫铝合金的力学性能、流体透过性能、声学性能、热传导性能和阻尼性能。
6)  heat conductivity
导热性
1.
The complex yarn had been made into knitted fabric and the heat conductivity of three fabrics was tested.
本文介绍了优质苎麻纤维与羊毛复合成纱的加工技术,对比检测了毛纱、麻纱、毛麻复合纱的条干、毛羽及强伸性能;开发了毛麻复合纱针织物,并测试了织物的导热性能。
2.
The mechanical properties,static heat conductivity,and dynamic heat build-.
研究了复合材料的力学性能、静态导热性能、动态温升等及它们与填充剂用量之间的关系。
补充资料:导电导热胶粘剂
分子式:
分子量:
CAS号:

性质:能起导电或(和)导热作用的胶粘剂。胶粘剂一般是绝缘性的,可加入银粉、炭黑等使之发生传导作用。常用的树脂有:环氧树脂、丙烯酸系树脂、酚醛树脂和聚氨酯等。用于电子管的真空导电密封、波导元件和印刷电路板的制造和修补、半导体收音机的安装以及电子计算机插件中线路等的粘合和修补等。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条